Thermal Modeling and Analysis of Power Electronic Components and Systems: Thermal Modeling and Simulation of Power Electronics Components and Systems

Peter R. Wilson

doi:10.1016/B978-0-12-811407-0.00052-0

Thermal Modeling and Analysis of Power Electronic Components and Systems: Thermal Modeling and Simulation of Power Electronics Components and Systems

Peter R. Wilson

Department of Electronic & Electrical Engineering

Research output: Chapter or section in a book/report/conference proceeding › Book chapter

12 Citations (SciVal)

Abstract

This chapter will introduce some basic techniques for modeling thermal circuits using lumped equivalent circuits that can be used in power electronic circuits. The fundamental thermal circuit concepts are introduced, and the methods by which these can be used in a practical manner by the power electronics designer are discussed.

Original language	English
Title of host publication	Power Electronics Handbook, Fourth Edition
Editors	Muhammad H. Rashid
Publisher	Elsevier Masson
Pages	1441-1450
Number of pages	10
Edition	4
ISBN (Electronic)	9780128114070
ISBN (Print)	9780128114087
DOIs	https://doi.org/10.1016/B978-0-12-811407-0.00052-0
Publication status	Published - 31 Dec 2018

Keywords

Convection
Device modeling
Magnetic components
Numerical methods
Radiation
Thermal conduction
Thermal modeling
Transient thermal impedance

ASJC Scopus subject areas

General Engineering

Access to Document

10.1016/B978-0-12-811407-0.00052-0

Cite this

Thermal Modeling and Analysis of Power Electronic Components and Systems: Thermal Modeling and Simulation of Power Electronics Components and Systems. / Wilson, Peter R.
Power Electronics Handbook, Fourth Edition. ed. / Muhammad H. Rashid . 4. ed. Elsevier Masson, 2018. p. 1441-1450 46.

Research output: Chapter or section in a book/report/conference proceeding › Book chapter

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KW - Convection

KW - Device modeling

KW - Magnetic components

KW - Numerical methods

KW - Radiation

KW - Thermal conduction

KW - Thermal modeling

KW - Transient thermal impedance

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PB - Elsevier Masson

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Thermal Modeling and Analysis of Power Electronic Components and Systems: Thermal Modeling and Simulation of Power Electronics Components and Systems

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

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