The effect of thermal performance on device current utilisation

Francis Robinson

doi:10.1109/PESC.1994.349699

The effect of thermal performance on device current utilisation

Department of Electronic & Electrical Engineering

Research output: Chapter or section in a book/report/conference proceeding › Chapter in a published conference proceeding

121 Downloads (Pure)

Abstract

A significant improvement in power semiconductor device utilisation seems possible if the maximum output current of power stages could be limited by thermal feedback from the power converter. To illustrate the potential utilisation benefit obtained in main switching devices, the variation in usable current with operating conditions is examined for several devices applied in a constant frequency PWM VVVF inverter, and operated under conditions to keep their junction temperature constant

Original language	English
Title of host publication	25th Annual IEEE Power Electronics Specialists Conference, PESC '94
Place of Publication	Taipei, Taiwan
Publisher	IEEE
Pages	427 - 433
Number of pages	7
Volume	1
ISBN (Print)	0-7803-1859-5
DOIs	https://doi.org/10.1109/PESC.1994.349699
Publication status	Published - 20 Jun 1994
Event	25th Annual IEEE Power Electronics Specialists Conference, PESC 1994 - Taipei, Taiwan, Province of China Duration: 20 Jun 1994 → 25 Jun 1994

Conference

Conference	25th Annual IEEE Power Electronics Specialists Conference, PESC 1994
Country/Territory	Taiwan, Province of China
City	Taipei
Period	20/06/94 → 25/06/94

Access to Document

10.1109/PESC.1994.349699

The effect of thermal performance on device current utilisation
(c) 1994 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works
Accepted author manuscript, 721 KB

Cite this

@inproceedings{c7cdf31673ee420bb9a6af4aac2eb149,

title = "The effect of thermal performance on device current utilisation",

abstract = "A significant improvement in power semiconductor device utilisation seems possible if the maximum output current of power stages could be limited by thermal feedback from the power converter. To illustrate the potential utilisation benefit obtained in main switching devices, the variation in usable current with operating conditions is examined for several devices applied in a constant frequency PWM VVVF inverter, and operated under conditions to keep their junction temperature constant",

author = "Francis Robinson",

year = "1994",

month = jun,

day = "20",

doi = "10.1109/PESC.1994.349699",

language = "English",

isbn = "0-7803-1859-5",

volume = "1",

pages = "427 -- 433",

booktitle = "25th Annual IEEE Power Electronics Specialists Conference, PESC '94",

publisher = "IEEE",

address = "USA United States",

note = "25th Annual IEEE Power Electronics Specialists Conference, PESC 1994 ; Conference date: 20-06-1994 Through 25-06-1994",

}

TY - GEN

T1 - The effect of thermal performance on device current utilisation

AU - Robinson, Francis

PY - 1994/6/20

Y1 - 1994/6/20

N2 - A significant improvement in power semiconductor device utilisation seems possible if the maximum output current of power stages could be limited by thermal feedback from the power converter. To illustrate the potential utilisation benefit obtained in main switching devices, the variation in usable current with operating conditions is examined for several devices applied in a constant frequency PWM VVVF inverter, and operated under conditions to keep their junction temperature constant

AB - A significant improvement in power semiconductor device utilisation seems possible if the maximum output current of power stages could be limited by thermal feedback from the power converter. To illustrate the potential utilisation benefit obtained in main switching devices, the variation in usable current with operating conditions is examined for several devices applied in a constant frequency PWM VVVF inverter, and operated under conditions to keep their junction temperature constant

UR - http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=349699

U2 - 10.1109/PESC.1994.349699

DO - 10.1109/PESC.1994.349699

M3 - Chapter in a published conference proceeding

SN - 0-7803-1859-5

VL - 1

SP - 427

EP - 433

BT - 25th Annual IEEE Power Electronics Specialists Conference, PESC '94

PB - IEEE

CY - Taipei, Taiwan

T2 - 25th Annual IEEE Power Electronics Specialists Conference, PESC 1994

Y2 - 20 June 1994 through 25 June 1994

ER -

The effect of thermal performance on device current utilisation

Abstract

Conference

Access to Document

Other files and links

Fingerprint

Cite this