The cost of service

X. X. Huang, M. E. Kreye, G. Parry, Y. M. Goh, L. B. Newnes

Research output: Chapter or section in a book/report/conference proceeding › Book chapter

Original language	English
Title of host publication	Cost Analysis of Electronic Systems
Editors	P. Sandborn
Place of Publication	Singapore
Publisher	World Scientific
Pages	349-362
ISBN (Print)	9789814383349
DOIs	https://doi.org/10.1142/9789814383356_0018
Publication status	Published - 2013

Name	WSPC Series in Advanced Integration and Packaging
Volume	1

Access to Document

@inbook{ec016f94085b4852a3a60924deb920ea,

title = "The cost of service",

author = "Huang, {X. X.} and Kreye, {M. E.} and G. Parry and Goh, {Y. M.} and Newnes, {L. B.}",

year = "2013",

doi = "10.1142/9789814383356_0018",

language = "English",

isbn = "9789814383349",

series = "WSPC Series in Advanced Integration and Packaging",

publisher = "World Scientific",

pages = "349--362",

editor = "P. Sandborn",

booktitle = "Cost Analysis of Electronic Systems",

}

TY - CHAP

T1 - The cost of service

AU - Huang, X. X.

AU - Kreye, M. E.

AU - Parry, G.

AU - Goh, Y. M.

AU - Newnes, L. B.

PY - 2013

Y1 - 2013

U2 - 10.1142/9789814383356_0018

DO - 10.1142/9789814383356_0018

M3 - Book chapter

SN - 9789814383349

T3 - WSPC Series in Advanced Integration and Packaging

SP - 349

EP - 362

BT - Cost Analysis of Electronic Systems

A2 - Sandborn, P.

PB - World Scientific

CY - Singapore

ER -