The cost of service

X. X. Huang, M. E. Kreye, G. Parry, Y. M. Goh, L. B. Newnes

Research output: Chapter in Book/Report/Conference proceedingChapter

LanguageEnglish
Title of host publicationCost Analysis of Electronic Systems
EditorsP. Sandborn
Place of PublicationSingapore
PublisherWorld Scientific
Pages349-362
ISBN (Print)9789814383349
StatusPublished - 2013

Publication series

NameWSPC Series in Advanced Integration and Packaging
Volume1

Cite this

Huang, X. X., Kreye, M. E., Parry, G., Goh, Y. M., & Newnes, L. B. (2013). The cost of service. In P. Sandborn (Ed.), Cost Analysis of Electronic Systems (pp. 349-362). (WSPC Series in Advanced Integration and Packaging; Vol. 1). Singapore: World Scientific.

The cost of service. / Huang, X. X.; Kreye, M. E.; Parry, G.; Goh, Y. M.; Newnes, L. B.

Cost Analysis of Electronic Systems. ed. / P. Sandborn. Singapore : World Scientific, 2013. p. 349-362 (WSPC Series in Advanced Integration and Packaging; Vol. 1).

Research output: Chapter in Book/Report/Conference proceedingChapter

Huang, XX, Kreye, ME, Parry, G, Goh, YM & Newnes, LB 2013, The cost of service. in P Sandborn (ed.), Cost Analysis of Electronic Systems. WSPC Series in Advanced Integration and Packaging, vol. 1, World Scientific, Singapore, pp. 349-362.
Huang XX, Kreye ME, Parry G, Goh YM, Newnes LB. The cost of service. In Sandborn P, editor, Cost Analysis of Electronic Systems. Singapore: World Scientific. 2013. p. 349-362. (WSPC Series in Advanced Integration and Packaging).
Huang, X. X. ; Kreye, M. E. ; Parry, G. ; Goh, Y. M. ; Newnes, L. B./ The cost of service. Cost Analysis of Electronic Systems. editor / P. Sandborn. Singapore : World Scientific, 2013. pp. 349-362 (WSPC Series in Advanced Integration and Packaging).
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