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Smart Packaging with Disposable NFC-enabled Wireless Gas Sensors for Monitoring Food Spoilage

  • Atharv Naik
  • , Hong Seok Lee
  • , Jack Herrington
  • , Giandrin Barandun
  • , Genevieve Flock
  • , Firat Güder
  • , Laura Gonzalez-Macia
  • Imperial College London
  • BlakBear Ltd
  • Combat Capabilities Development Command Soldier Center
  • Department of Bioengineering

Research output: Contribution to journalArticlepeer-review

52   Link opens in a new tab Citations (SciVal)

Abstract

Gas sensors present an alternative to traditional off-package food quality assessment, due to their high sensitivity and fast response without the need of sample pretreatment. The safe integration of gas sensors into packaging without compromising sensitivity, response rate, and stability, however, remains a challenge. Such packaging integration of spoilage sensors is crucial for preventing food waste and transitioning toward more sustainable supply chains. Here, we demonstrate a wide-ranging solution to enable the use of gas sensors for the continuous monitoring of food spoilage, building upon our previous work on paper-based electrical gas sensors (PEGS). By comparing various materials commonly used in the food industry, we analyze the optimal membrane to encapsulate PEGS for packaging integration. Focusing on spinach as a high-value crop, we assess the feasibility of PEGS to monitor the gases released during its spoilage at low and room temperatures. Finally, we integrated the sensors with wireless communication and batteryless electronics, creating a user-friendly system to evaluate the spoilage of spinach, operated by a smartphone via near-field communication (NFC). The work reported here provides an alternative approach that surpasses traditional on-site and in-line monitoring, ensuring comprehensive monitoring of food shelf life.

Original languageEnglish
Pages (from-to)6789-6799
Number of pages11
JournalACS Sensors
Volume9
Issue number12
Early online date16 Dec 2024
DOIs
Publication statusPublished - 27 Dec 2024

Bibliographical note

Publisher Copyright:
© 2024 The Authors. Published by American Chemical Society.

Acknowledgements

The authors thank the Department of Bioengineering at Imperial College London. F.G. and L.G.-M. thank the US Army (grant number W911QY-20-R-0022) and the European Union’s Horizon 2020 research and innovation program under the Marie Sklodowska-Curie grant agreement no. 101025390. F.G. and J.H. thank the EPSRC (EP/L016702/1). F.G. and J.H. acknowledge Imperial College Centre for Processable Electronics and the Centre for Doctoral Training in Plastic Electronics. H.S.L. thanks London Interdisciplinary Social Science Doctoral Training Partnership. F.G. and L.G.-M. thank the Bill and Melinda Gates Foundation (Grand Challenges Explorations scheme under grant numbers OPP1212574 and INV-038695). F.G. thanks Bezos Earth Fund through the Bezos Centre for Sustainable Protein (BCSP/IC/001).

Keywords

  • encapsulation films
  • food spoilage
  • gas sensors
  • real-time monitoring
  • smart packaging

ASJC Scopus subject areas

  • Bioengineering
  • Instrumentation
  • Process Chemistry and Technology
  • Fluid Flow and Transfer Processes

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