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Optical transceiver integrated on PCB using electro-optic connectors compatible with pick-and-place assembly technology

  • Nikolaos Bamiedakis
  • , Joseph Beals IV
  • , Aeffendi H. Hashim
  • , Richard V. Penty
  • , Ian H. White
  • University of Cambridge

Research output: Chapter or section in a book/report/conference proceeding › Chapter in a published conference proceeding

15   Link opens in a new tab Citations (SciVal)

Abstract

An optical transceiver formed onto a conventional low-cost printed circuit board with integrated optical waveguides is presented. The transceiver incorporates an optical multimode polymer Y-splitter formed directly on a low-cost singlelayered FR4 substrate enabling duplex transmission along a single optical fibre. The transmitter and receiver assemblies are mounted onto the board using methods common to conventional PCB manufacturing. Simple through-board connectors, compatible with pick-and-place assembly technology, are used to interface the electrical and optical layers of the board. This approach allows end-fired optical coupling between the active devices and optical waveguides on the board. The demonstrated transceiver, intended as a board-level optical network unit, achieves error-free data transmission for both Tx and Rx modules at 10 Gb/s.

Original languageEnglish
Title of host publicationOptoelectronic Interconnects and Component Integration IX
DOIs
Publication statusPublished - 10 May 2010
EventOptoelectronic Interconnects and Component Integration IX - San Francisco, CA, USA United States
Duration: 25 Jan 2010 → 27 Jan 2010

Publication series

NameProceedings of SPIE
Volume7607

Conference

ConferenceOptoelectronic Interconnects and Component Integration IX
Country/TerritoryUSA United States
CitySan Francisco, CA
Period25/01/10 → 27/01/10

Keywords

  • Electro-optic connector
  • Optical interconnects
  • Optical transceiver
  • Optoelectronic integration
  • Optoelectronic printed circuit board
  • Polymer waveguides

ASJC Scopus subject areas

  • Applied Mathematics
  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

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