Novel regrowth-free vertical active-passive integration scheme with improved fabrication tolerance

C. W. Tee, K. A. Williams, R. V. Penty, I. H. White, U. Troppenz, M. Hamacher, H. Heidrich

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present a novel vertically-coupled active-passive integration architecture that provides an order of magnitude reduction in coupling coefficient variation between misaligned waveguides when compared with a conventional vertically-coupled structure.

Original languageEnglish
Title of host publication2005 Quantum Electronics and Laser Science Conference (QELS)
Pages948-950
Number of pages3
Publication statusPublished - 31 Oct 2005
Event2005 Quantum Electronics and Laser Science Conference (QELS) - Baltimore, MD, USA United States
Duration: 22 May 200527 May 2005

Publication series

NameQuantum Electronics and Laser Science Conference (QELS)
Volume2

Conference

Conference2005 Quantum Electronics and Laser Science Conference (QELS)
CountryUSA United States
CityBaltimore, MD
Period22/05/0527/05/05

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'Novel regrowth-free vertical active-passive integration scheme with improved fabrication tolerance'. Together they form a unique fingerprint.

Cite this