New prototype assembly methods for biosensor integrated circuits

Anthony H D Graham, Christopher R Bowen, Susan M Surguy, Jon Robbins, John Taylor

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

Two new prototype assembly methods have been evaluated for biosensors that combine an integrated circuit (IC) sensor with a culture chamber. The first method uses a poly-ethylene glycol (PEG) mould to mask the IC sensor during application of a room temperature vulcanising (RTV) silicone elastomer used to insulate the bondpads and bondwires. The second method utilises the 'partial encapsulation' service offered by Quik-Pak, USA. Both methods were shown to provide good electrical insulation and demonstrated biocompatibility with the NG108-15 cell line. These methods are particularly useful for the assembly of low-cost ICs with a small (4 mm2) sensor area.
Original languageEnglish
Pages (from-to)973-979
Number of pages7
JournalMedical Engineering & Physics
Volume33
Issue number8
DOIs
Publication statusPublished - Oct 2011

Fingerprint

Biosensing Techniques
Biosensors
Integrated circuits
Sensors
Biocompatibility
Encapsulation
Elastomers
Silicones
Polyethylene glycols
Insulation
Masks
Silicone Elastomers
Cells
Ethylene Glycol
Fungi
Costs
Costs and Cost Analysis
Cell Line
Temperature

Keywords

  • packaging
  • assembly
  • partial encapsulation
  • biosensor
  • prototype
  • integrated circuit

Cite this

New prototype assembly methods for biosensor integrated circuits. / Graham, Anthony H D; Bowen, Christopher R; Surguy, Susan M; Robbins, Jon; Taylor, John.

In: Medical Engineering & Physics, Vol. 33, No. 8, 10.2011, p. 973-979.

Research output: Contribution to journalArticle

Graham, Anthony H D ; Bowen, Christopher R ; Surguy, Susan M ; Robbins, Jon ; Taylor, John. / New prototype assembly methods for biosensor integrated circuits. In: Medical Engineering & Physics. 2011 ; Vol. 33, No. 8. pp. 973-979.
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