Two new prototype assembly methods have been evaluated for biosensors that combine an integrated circuit (IC) sensor with a culture chamber. The first method uses a poly-ethylene glycol (PEG) mould to mask the IC sensor during application of a room temperature vulcanising (RTV) silicone elastomer used to insulate the bondpads and bondwires. The second method utilises the 'partial encapsulation' service offered by Quik-Pak, USA. Both methods were shown to provide good electrical insulation and demonstrated biocompatibility with the NG108-15 cell line. These methods are particularly useful for the assembly of low-cost ICs with a small (4 mm2) sensor area.
- partial encapsulation
- integrated circuit
Graham, A. H. D., Bowen, C. R., Surguy, S. M., Robbins, J., & Taylor, J. (2011). New prototype assembly methods for biosensor integrated circuits. Medical Engineering & Physics, 33(8), 973-979. https://doi.org/10.1016/j.medengphy.2011.03.006