New prototype assembly methods for biosensor integrated circuits

Anthony H D Graham, Christopher R Bowen, Susan M Surguy, Jon Robbins, John Taylor

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

Two new prototype assembly methods have been evaluated for biosensors that combine an integrated circuit (IC) sensor with a culture chamber. The first method uses a poly-ethylene glycol (PEG) mould to mask the IC sensor during application of a room temperature vulcanising (RTV) silicone elastomer used to insulate the bondpads and bondwires. The second method utilises the 'partial encapsulation' service offered by Quik-Pak, USA. Both methods were shown to provide good electrical insulation and demonstrated biocompatibility with the NG108-15 cell line. These methods are particularly useful for the assembly of low-cost ICs with a small (4 mm2) sensor area.
Original languageEnglish
Pages (from-to)973-979
Number of pages7
JournalMedical Engineering & Physics
Volume33
Issue number8
DOIs
Publication statusPublished - Oct 2011

    Fingerprint

Keywords

  • packaging
  • assembly
  • partial encapsulation
  • biosensor
  • prototype
  • integrated circuit

Cite this