New prototype assembly methods for biosensor integrated circuits

Anthony H D Graham; Christopher R Bowen; Susan M Surguy; Jon Robbins; John Taylor

doi:10.1016/j.medengphy.2011.03.006

New prototype assembly methods for biosensor integrated circuits

Anthony H D Graham, Christopher R Bowen, Susan M Surguy, Jon Robbins, John Taylor

Research output: Contribution to journal › Article › peer-review

11 Citations (SciVal)

Abstract

Two new prototype assembly methods have been evaluated for biosensors that combine an integrated circuit (IC) sensor with a culture chamber. The first method uses a poly-ethylene glycol (PEG) mould to mask the IC sensor during application of a room temperature vulcanising (RTV) silicone elastomer used to insulate the bondpads and bondwires. The second method utilises the 'partial encapsulation' service offered by Quik-Pak, USA. Both methods were shown to provide good electrical insulation and demonstrated biocompatibility with the NG108-15 cell line. These methods are particularly useful for the assembly of low-cost ICs with a small (4 mm2) sensor area.

Original language	English
Pages (from-to)	973-979
Number of pages	7
Journal	Medical Engineering & Physics
Volume	33
Issue number	8
DOIs	https://doi.org/10.1016/j.medengphy.2011.03.006
Publication status	Published - Oct 2011

Keywords

packaging
assembly
partial encapsulation
biosensor
prototype
integrated circuit

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10.1016/j.medengphy.2011.03.006

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title = "New prototype assembly methods for biosensor integrated circuits",

abstract = "Two new prototype assembly methods have been evaluated for biosensors that combine an integrated circuit (IC) sensor with a culture chamber. The first method uses a poly-ethylene glycol (PEG) mould to mask the IC sensor during application of a room temperature vulcanising (RTV) silicone elastomer used to insulate the bondpads and bondwires. The second method utilises the 'partial encapsulation' service offered by Quik-Pak, USA. Both methods were shown to provide good electrical insulation and demonstrated biocompatibility with the NG108-15 cell line. These methods are particularly useful for the assembly of low-cost ICs with a small (4 mm2) sensor area.",

keywords = "packaging, assembly, partial encapsulation, biosensor, prototype, integrated circuit",

author = "Graham, {Anthony H D} and Bowen, {Christopher R} and Surguy, {Susan M} and Jon Robbins and John Taylor",

year = "2011",

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language = "English",

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T1 - New prototype assembly methods for biosensor integrated circuits

AU - Graham, Anthony H D

AU - Bowen, Christopher R

AU - Surguy, Susan M

AU - Robbins, Jon

AU - Taylor, John

PY - 2011/10

Y1 - 2011/10

N2 - Two new prototype assembly methods have been evaluated for biosensors that combine an integrated circuit (IC) sensor with a culture chamber. The first method uses a poly-ethylene glycol (PEG) mould to mask the IC sensor during application of a room temperature vulcanising (RTV) silicone elastomer used to insulate the bondpads and bondwires. The second method utilises the 'partial encapsulation' service offered by Quik-Pak, USA. Both methods were shown to provide good electrical insulation and demonstrated biocompatibility with the NG108-15 cell line. These methods are particularly useful for the assembly of low-cost ICs with a small (4 mm2) sensor area.

AB - Two new prototype assembly methods have been evaluated for biosensors that combine an integrated circuit (IC) sensor with a culture chamber. The first method uses a poly-ethylene glycol (PEG) mould to mask the IC sensor during application of a room temperature vulcanising (RTV) silicone elastomer used to insulate the bondpads and bondwires. The second method utilises the 'partial encapsulation' service offered by Quik-Pak, USA. Both methods were shown to provide good electrical insulation and demonstrated biocompatibility with the NG108-15 cell line. These methods are particularly useful for the assembly of low-cost ICs with a small (4 mm2) sensor area.

KW - packaging

KW - assembly

KW - partial encapsulation

KW - biosensor

KW - prototype

KW - integrated circuit

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DO - 10.1016/j.medengphy.2011.03.006

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VL - 33

SP - 973

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JO - Medical Engineering & Physics

JF - Medical Engineering & Physics

IS - 8

ER -

New prototype assembly methods for biosensor integrated circuits

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Keywords

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