Nano-interconnects for atomic and molecular scale circuits

Naing Thet

Nano-interconnects for atomic and molecular scale circuits

Department of Chemistry

Research output: Patent

Abstract

A method for forming interconnects in a substrate, the substrate comprising a semiconductor layer on an oxide layer forming a silicon-on-oxide substrate, the method comprising forming a plurality of holes into the substrate to the semiconductor layer, and metalizing the plurality of holes to form the interconnects.

Original language	English
Patent number	PCT/SG2007/000247
Priority date	10/08/07
Publication status	Published - 16 Apr 2013

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@misc{afb3e557ef2e4d049528be533a9cf816,

title = "Nano-interconnects for atomic and molecular scale circuits",

abstract = "A method for forming interconnects in a substrate, the substrate comprising a semiconductor layer on an oxide layer forming a silicon-on-oxide substrate, the method comprising forming a plurality of holes into the substrate to the semiconductor layer, and metalizing the plurality of holes to form the interconnects.",

author = "Naing Thet",

year = "2013",

month = apr,

day = "16",

language = "English",

type = "Patent",

note = "PCT/SG2007/000247",

}

TY - PAT

T1 - Nano-interconnects for atomic and molecular scale circuits

AU - Thet, Naing

PY - 2013/4/16

Y1 - 2013/4/16

N2 - A method for forming interconnects in a substrate, the substrate comprising a semiconductor layer on an oxide layer forming a silicon-on-oxide substrate, the method comprising forming a plurality of holes into the substrate to the semiconductor layer, and metalizing the plurality of holes to form the interconnects.

AB - A method for forming interconnects in a substrate, the substrate comprising a semiconductor layer on an oxide layer forming a silicon-on-oxide substrate, the method comprising forming a plurality of holes into the substrate to the semiconductor layer, and metalizing the plurality of holes to form the interconnects.

M3 - Patent

M1 - PCT/SG2007/000247

ER -

Nano-interconnects for atomic and molecular scale circuits

Abstract

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