Multimode siloxane polymer components for optical interconnects

Nikolaos Bamiedakis, Joseph Beals IV, Richard V. Penty, Ian H. White, Jon V. DeGroot, Terry V. Clapp, David De Shazerb

Research output: Chapter or section in a book/report/conference proceedingChapter in a published conference proceeding

1 Citation (SciVal)


This paper presents an overview of multimode waveguides and waveguide components formed from siloxane polymer materials which are suitable for use in optical interconnection applications. The components can be cost-effectively integrated onto conventional PCBs and offer increased functionality in optical transmission. The multimode waveguides exhibit low loss (0.04 dB/cm at 850 nm) and low crosstalk (> -30 dB) performance, large alignment tolerances and negligible mode mixing for short waveguide lengths. Error-free data transmission at 10 Gb/s over 1.4 m long waveguides has been successfully demonstrated. Waveguide crossings exhibit very low excess losses, below 0.01 dB/crossing, and excellent crosstalk performance. Low loss is obtained for waveguide bends with radii of curvature larger than 8 mm and 6 mm for 90deg; and S-shaped bends respectively. High-uniformity splitting is achieved with multimode Y-splitters even in the presence of input misalignments. Y-combiners are shown to benefit from the multimode nature of the waveguides allowing low loss combining (4 dB for an 8×1 device). A large range of power splitting ratios between 30% and 75% is achieved with multimode coupler devices. Examples of system applications benefiting from the use of these components are briefly presented including a terabit capacity optical backplane, a radio-over-fibre multicasting system and a SCM passive optical network.

Original languageEnglish
Title of host publicationPhotonics Packaging, Integration, and Interconnects IX
Place of PublicationU. S. A.
ISBN (Print)9780819474674
Publication statusPublished - 12 Feb 2009
EventPhotonics Packaging, Integration, and Interconnects IX - San Jose, CA, USA United States
Duration: 26 Jan 200928 Jan 2009

Publication series

NameProceedings of SPIE


ConferencePhotonics Packaging, Integration, and Interconnects IX
Country/TerritoryUSA United States
CitySan Jose, CA


  • Optical interconnection
  • Passive components
  • Polymer
  • Waveguide

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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