Abstract
GaN is a potential sensor material for harsh environments due to its piezoelectric and mechanical properties. In this paper an 8mm diameter sensor structure is proposed based on a GaN / AlGaN / sapphire HEMT wafer. The discs will be glass-bonded to an alumina package, creating a 'drumskin' type sensor that is sensitive to pressure changes. The electromechanical behaviour of the sensor is studied in an attempt to optimise the design of a pressure sensor (HEMT position and sapphire thickness) for operation in the range of 10 - 50 bar (5 MPa) and above 300°C
| Original language | English |
|---|---|
| Title of host publication | Conference Proceedings - The 18th International Conference on Advanced Semiconductor Devices and Microsystems, ASDAM 2010 |
| Place of Publication | Piscataway, NJ |
| Publisher | IEEE |
| Pages | 127-130 |
| Number of pages | 4 |
| DOIs | |
| Publication status | Published - Oct 2010 |
| Event | 18th International Conference on Advanced Semiconductor Devices and Microsystems - Smolenice, Slovakia Duration: 25 Oct 2010 → 27 Oct 2010 |
Conference
| Conference | 18th International Conference on Advanced Semiconductor Devices and Microsystems |
|---|---|
| Abbreviated title | ASDAM 2010 |
| Country/Territory | Slovakia |
| City | Smolenice |
| Period | 25/10/10 → 27/10/10 |
Fingerprint
Dive into the research topics of 'Modelling and optimisation of a sapphire/GaN-based diaphragm structure for pressure sensing in harsh environments'. Together they form a unique fingerprint.Cite this
- APA
- Standard
- Harvard
- Vancouver
- Author
- BIBTEX
- RIS