Abstract
GaN is a potential sensor material for harsh environments due to its piezoelectric and mechanical properties. In this paper an 8mm diameter sensor structure is proposed based on a GaN / AlGaN / sapphire HEMT wafer. The discs will be glass-bonded to an alumina package, creating a 'drumskin' type sensor that is sensitive to pressure changes. The electromechanical behaviour of the sensor is studied in an attempt to optimise the design of a pressure sensor (HEMT position and sapphire thickness) for operation in the range of 10 - 50 bar (5 MPa) and above 300°C
Original language | English |
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Title of host publication | Conference Proceedings - The 18th International Conference on Advanced Semiconductor Devices and Microsystems, ASDAM 2010 |
Place of Publication | Piscataway, NJ |
Publisher | IEEE |
Pages | 127-130 |
Number of pages | 4 |
DOIs | |
Publication status | Published - Oct 2010 |
Event | 18th International Conference on Advanced Semiconductor Devices and Microsystems - Smolenice, Slovakia Duration: 25 Oct 2010 → 27 Oct 2010 |
Conference
Conference | 18th International Conference on Advanced Semiconductor Devices and Microsystems |
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Abbreviated title | ASDAM 2010 |
Country/Territory | Slovakia |
City | Smolenice |
Period | 25/10/10 → 27/10/10 |