Measurement and Modelling of MIC Components Using Conductive Lithographic Films

P R Shepherd, C Taylor, P S A Evans, D J Harrison

Research output: Contribution to conferencePaper

5 Citations (Scopus)

Abstract

Conductive Lithographic Films (CLFs) have previously demonstrated useful properties in printed microwave circuits, combining low cost with high speed of manufacture. In this paper we examine the formation of various passive components via the CLF process, which enables further integration of printed microwave integrated circuits. The printed components include vias, resistors and overlay capacitors, and offer viable alternatives to traditional manufacturing processes for Microwave Integrated Circuits (MICs). Manufacturing data, measurements on test structures and equivalent circuit modelling for a range of CLF circuit structures are presented.
Original languageEnglish
Pages1-4
Number of pages4
Publication statusPublished - 2001
Event31st European Microwave Conference - London, UK United Kingdom
Duration: 25 Sep 200127 Sep 2001

Conference

Conference31st European Microwave Conference
CountryUK United Kingdom
CityLondon
Period25/09/0127/09/01

Fingerprint Dive into the research topics of 'Measurement and Modelling of MIC Components Using Conductive Lithographic Films'. Together they form a unique fingerprint.

Cite this