Measurement and Modelling of MIC Components Using Conductive Lithographic Films

P R Shepherd, C Taylor, P S A Evans, D J Harrison

Research output: Contribution to conferencePaper

5 Citations (SciVal)


Conductive Lithographic Films (CLFs) have previously demonstrated useful properties in printed microwave circuits, combining low cost with high speed of manufacture. In this paper we examine the formation of various passive components via the CLF process, which enables further integration of printed microwave integrated circuits. The printed components include vias, resistors and overlay capacitors, and offer viable alternatives to traditional manufacturing processes for Microwave Integrated Circuits (MICs). Manufacturing data, measurements on test structures and equivalent circuit modelling for a range of CLF circuit structures are presented.
Original languageEnglish
Number of pages4
Publication statusPublished - 2001
Event31st European Microwave Conference - London, UK United Kingdom
Duration: 25 Sept 200127 Sept 2001


Conference31st European Microwave Conference
Country/TerritoryUK United Kingdom


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