Measurement and Modelling of MIC Components Using Conductive Lithographic Films

P R Shepherd; C Taylor; P S A Evans; D J Harrison

Measurement and Modelling of MIC Components Using Conductive Lithographic Films

P R Shepherd, C Taylor, P S A Evans, D J Harrison

Department of Electronic & Electrical Engineering

Research output: Contribution to conference › Paper

5 Citations (SciVal)

Abstract

Conductive Lithographic Films (CLFs) have previously demonstrated useful properties in printed microwave circuits, combining low cost with high speed of manufacture. In this paper we examine the formation of various passive components via the CLF process, which enables further integration of printed microwave integrated circuits. The printed components include vias, resistors and overlay capacitors, and offer viable alternatives to traditional manufacturing processes for Microwave Integrated Circuits (MICs). Manufacturing data, measurements on test structures and equivalent circuit modelling for a range of CLF circuit structures are presented.

Original language	English
Pages	1-4
Number of pages	4
Publication status	Published - 2001
Event	31st European Microwave Conference - London, UK United Kingdom Duration: 25 Sept 2001 → 27 Sept 2001

Conference

Conference	31st European Microwave Conference
Country/Territory	UK United Kingdom
City	London
Period	25/09/01 → 27/09/01

Cite this

@conference{5e276f66d38c4c038f6b7f6acd600df7,

title = "Measurement and Modelling of MIC Components Using Conductive Lithographic Films",

abstract = "Conductive Lithographic Films (CLFs) have previously demonstrated useful properties in printed microwave circuits, combining low cost with high speed of manufacture. In this paper we examine the formation of various passive components via the CLF process, which enables further integration of printed microwave integrated circuits. The printed components include vias, resistors and overlay capacitors, and offer viable alternatives to traditional manufacturing processes for Microwave Integrated Circuits (MICs). Manufacturing data, measurements on test structures and equivalent circuit modelling for a range of CLF circuit structures are presented.",

author = "Shepherd, {P R} and C Taylor and Evans, {P S A} and Harrison, {D J}",

year = "2001",

language = "English",

pages = "1--4",

note = "31st European Microwave Conference ; Conference date: 25-09-2001 Through 27-09-2001",

}

TY - CONF

T1 - Measurement and Modelling of MIC Components Using Conductive Lithographic Films

AU - Shepherd, P R

AU - Taylor, C

AU - Evans, P S A

AU - Harrison, D J

PY - 2001

Y1 - 2001

N2 - Conductive Lithographic Films (CLFs) have previously demonstrated useful properties in printed microwave circuits, combining low cost with high speed of manufacture. In this paper we examine the formation of various passive components via the CLF process, which enables further integration of printed microwave integrated circuits. The printed components include vias, resistors and overlay capacitors, and offer viable alternatives to traditional manufacturing processes for Microwave Integrated Circuits (MICs). Manufacturing data, measurements on test structures and equivalent circuit modelling for a range of CLF circuit structures are presented.

AB - Conductive Lithographic Films (CLFs) have previously demonstrated useful properties in printed microwave circuits, combining low cost with high speed of manufacture. In this paper we examine the formation of various passive components via the CLF process, which enables further integration of printed microwave integrated circuits. The printed components include vias, resistors and overlay capacitors, and offer viable alternatives to traditional manufacturing processes for Microwave Integrated Circuits (MICs). Manufacturing data, measurements on test structures and equivalent circuit modelling for a range of CLF circuit structures are presented.

M3 - Paper

SP - 1

EP - 4

T2 - 31st European Microwave Conference

Y2 - 25 September 2001 through 27 September 2001

ER -

Measurement and Modelling of MIC Components Using Conductive Lithographic Films

Abstract

Conference

Fingerprint

Cite this