Low-cost 10 Gb/s chip-to-chip optical interconnect

Aeffendi Hashim; Nikos Bamiedakis; Richard V. Penty; Ian H. White

doi:10.1109/ECOC.2010.5621276

Low-cost 10 Gb/s chip-to-chip optical interconnect

Aeffendi Hashim
, Nikos Bamiedakis
, Richard V. Penty
, Ian H. White

Vice Chancellor's Office

University of Cambridge

Research output: Chapter or section in a book/report/conference proceeding › Chapter in a published conference proceeding

5 Citations (SciVal)

Abstract

A fully-integrated chip-to-chip optical interconnect fabricated on a low-cost single-layered FR4 substrate primarily using conventional electronic manufacturing practices is demonstrated. The interconnect achieves error-free 10 Gb/s data transmission and a better than ±13 μm tolerance to component misalignments.

Original language	English
Title of host publication	ECOC 2010 - 36th European Conference and Exhibition on Optical Communication, Proceedings
Volume	1-2
ISBN (Electronic)	9781424485352
DOIs	https://doi.org/10.1109/ECOC.2010.5621276
Publication status	Published - 31 Dec 2010
Event	36th European Conference and Exhibition on Optical Communication, ECOC 2010 - Torino, Italy Duration: 19 Sept 2010 → 23 Sept 2010

Conference

Conference	36th European Conference and Exhibition on Optical Communication, ECOC 2010
Country/Territory	Italy
City	Torino
Period	19/09/10 → 23/09/10

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/ECOC.2010.5621276

Cite this

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title = "Low-cost 10 Gb/s chip-to-chip optical interconnect",

abstract = "A fully-integrated chip-to-chip optical interconnect fabricated on a low-cost single-layered FR4 substrate primarily using conventional electronic manufacturing practices is demonstrated. The interconnect achieves error-free 10 Gb/s data transmission and a better than ±13 μm tolerance to component misalignments.",

author = "Aeffendi Hashim and Nikos Bamiedakis and Penty, \{Richard V.\} and White, \{Ian H.\}",

year = "2010",

month = dec,

day = "31",

doi = "10.1109/ECOC.2010.5621276",

language = "English",

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volume = "1-2",

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note = "36th European Conference and Exhibition on Optical Communication, ECOC 2010 ; Conference date: 19-09-2010 Through 23-09-2010",

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AU - Hashim, Aeffendi

AU - Bamiedakis, Nikos

AU - Penty, Richard V.

AU - White, Ian H.

PY - 2010/12/31

Y1 - 2010/12/31

N2 - A fully-integrated chip-to-chip optical interconnect fabricated on a low-cost single-layered FR4 substrate primarily using conventional electronic manufacturing practices is demonstrated. The interconnect achieves error-free 10 Gb/s data transmission and a better than ±13 μm tolerance to component misalignments.

AB - A fully-integrated chip-to-chip optical interconnect fabricated on a low-cost single-layered FR4 substrate primarily using conventional electronic manufacturing practices is demonstrated. The interconnect achieves error-free 10 Gb/s data transmission and a better than ±13 μm tolerance to component misalignments.

UR - https://www.scopus.com/pages/publications/78650595334

U2 - 10.1109/ECOC.2010.5621276

DO - 10.1109/ECOC.2010.5621276

M3 - Chapter in a published conference proceeding

AN - SCOPUS:78650595334

SN - 9781424485369

VL - 1-2

BT - ECOC 2010 - 36th European Conference and Exhibition on Optical Communication, Proceedings

T2 - 36th European Conference and Exhibition on Optical Communication, ECOC 2010

Y2 - 19 September 2010 through 23 September 2010

ER -

Low-cost 10 Gb/s chip-to-chip optical interconnect

Abstract

Conference

ASJC Scopus subject areas

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