Abstract
A fully-integrated chip-to-chip optical interconnect fabricated on a low-cost single-layered FR4 substrate primarily using conventional electronic manufacturing practices is demonstrated. The interconnect achieves error-free 10 Gb/s data transmission and a better than ±13 μm tolerance to component misalignments.
Original language | English |
---|---|
Title of host publication | ECOC 2010 - 36th European Conference and Exhibition on Optical Communication, Proceedings |
Volume | 1-2 |
ISBN (Electronic) | 9781424485352 |
DOIs | |
Publication status | Published - 31 Dec 2010 |
Event | 36th European Conference and Exhibition on Optical Communication, ECOC 2010 - Torino, Italy Duration: 19 Sept 2010 → 23 Sept 2010 |
Conference
Conference | 36th European Conference and Exhibition on Optical Communication, ECOC 2010 |
---|---|
Country/Territory | Italy |
City | Torino |
Period | 19/09/10 → 23/09/10 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials