Low-cost 10 Gb/s chip-to-chip optical interconnect

Aeffendi Hashim, Nikos Bamiedakis, Richard V. Penty, Ian H. White

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

A fully-integrated chip-to-chip optical interconnect fabricated on a low-cost single-layered FR4 substrate primarily using conventional electronic manufacturing practices is demonstrated. The interconnect achieves error-free 10 Gb/s data transmission and a better than ±13 μm tolerance to component misalignments.

Original languageEnglish
Title of host publicationECOC 2010 - 36th European Conference and Exhibition on Optical Communication, Proceedings
Volume1-2
ISBN (Electronic)9781424485352
DOIs
Publication statusPublished - 31 Dec 2010
Event36th European Conference and Exhibition on Optical Communication, ECOC 2010 - Torino, Italy
Duration: 19 Sep 201023 Sep 2010

Conference

Conference36th European Conference and Exhibition on Optical Communication, ECOC 2010
CountryItaly
CityTorino
Period19/09/1023/09/10

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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