Results of an experimental investigation into the thermal behavior and mechanical properties of a room-temperature-cured epoxy adhesive (diglycidyl ether of bisphenol A, DGEBA) cross-linked with polyetheramines and filled with different fillers, namely nanosilica, liquid rubber (CTBN), and clay, are reported. The nanosilica and liquid rubber increased the flexural strength and elastic modulus of the adhesive systems; the addition of clay particles raised the elastic modulus significantly, but embrittled the adhesive. Establishing a correct cure time is very important for bonded-in timber structures, as it will affect the bond strength. A study on the effect of cure time on the flexural strength was carried out, from which it follows that the adhesives should be cured for at least 20 days at room temperature. The damping characteristics and the glass-transition temperature of the adhesives were determined by using a dynamic mechanical thermal analysis. The results showed that the filled adhesives had a higher storage modulus, which was in agreement with the elastic moduli determined from static bending tests. The introduction of the fillers increased its glass-transition temperature considerably. © Springer Science+Business Media, Inc. 2006.
- Nanostructured materials
- Thermal effects