Indentation creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solder alloys

R. Mahmudi; A. R. Geranmayeh; H. Khanbareh; N. Jahangiri

doi:10.1016/j.matdes.2008.05.058

Indentation creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solder alloys

R. Mahmudi, A. R. Geranmayeh, H. Khanbareh, N. Jahangiri

Department of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

21 Citations (SciVal)

Abstract

Creep behavior of Sn-9%Zn and Sn-8%Zn-3%Bi solders together with Sn-37% Pb, as the material for comparison, was studied by indentation tests at room-temperature (T > 0.6T_m) in order to evaluate the correspondence of the creep results obtained by different methods of analysis, and to evaluate the effect of Bi on the creep response of the eutectic Sn-9%Zn alloy. Stress exponent values determined through these methods were in good agreement. The better creep resistance of the ternary alloy is attributed to solid solutioning effect and precipitation of Bi in the Sn matrix. Both tin-based alloys showed creep resistances higher than that of the Sn-37% Pb alloy.

Original language	English
Pages (from-to)	574-580
Number of pages	7
Journal	Materials & Design
Volume	30
Issue number	3
DOIs	https://doi.org/10.1016/j.matdes.2008.05.058
Publication status	Published - Mar 2009

Keywords

E.Creep
Mechanical

ASJC Scopus subject areas

Materials Science(all)
Mechanics of Materials
Mechanical Engineering

Access to Document

10.1016/j.matdes.2008.05.058

https://doi.org/10.1016/j.matdes.2008.05.058

Cite this

@article{2f49b1cef4014b47a340872affcc89f1,

title = "Indentation creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solder alloys",

abstract = "Creep behavior of Sn-9%Zn and Sn-8%Zn-3%Bi solders together with Sn-37% Pb, as the material for comparison, was studied by indentation tests at room-temperature (T > 0.6Tm) in order to evaluate the correspondence of the creep results obtained by different methods of analysis, and to evaluate the effect of Bi on the creep response of the eutectic Sn-9%Zn alloy. Stress exponent values determined through these methods were in good agreement. The better creep resistance of the ternary alloy is attributed to solid solutioning effect and precipitation of Bi in the Sn matrix. Both tin-based alloys showed creep resistances higher than that of the Sn-37% Pb alloy.",

keywords = "E.Creep, Mechanical",

author = "R. Mahmudi and Geranmayeh, {A. R.} and H. Khanbareh and N. Jahangiri",

year = "2009",

month = mar,

doi = "10.1016/j.matdes.2008.05.058",

language = "English",

volume = "30",

pages = "574--580",

journal = "Materials & Design",

issn = "0261-3069",

publisher = "Elsevier",

number = "3",

}

TY - JOUR

T1 - Indentation creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solder alloys

AU - Mahmudi, R.

AU - Geranmayeh, A. R.

AU - Khanbareh, H.

AU - Jahangiri, N.

PY - 2009/3

Y1 - 2009/3

N2 - Creep behavior of Sn-9%Zn and Sn-8%Zn-3%Bi solders together with Sn-37% Pb, as the material for comparison, was studied by indentation tests at room-temperature (T > 0.6Tm) in order to evaluate the correspondence of the creep results obtained by different methods of analysis, and to evaluate the effect of Bi on the creep response of the eutectic Sn-9%Zn alloy. Stress exponent values determined through these methods were in good agreement. The better creep resistance of the ternary alloy is attributed to solid solutioning effect and precipitation of Bi in the Sn matrix. Both tin-based alloys showed creep resistances higher than that of the Sn-37% Pb alloy.

AB - Creep behavior of Sn-9%Zn and Sn-8%Zn-3%Bi solders together with Sn-37% Pb, as the material for comparison, was studied by indentation tests at room-temperature (T > 0.6Tm) in order to evaluate the correspondence of the creep results obtained by different methods of analysis, and to evaluate the effect of Bi on the creep response of the eutectic Sn-9%Zn alloy. Stress exponent values determined through these methods were in good agreement. The better creep resistance of the ternary alloy is attributed to solid solutioning effect and precipitation of Bi in the Sn matrix. Both tin-based alloys showed creep resistances higher than that of the Sn-37% Pb alloy.

KW - E.Creep

KW - Mechanical

UR - http://www.scopus.com/inward/record.url?scp=57149104928&partnerID=8YFLogxK

UR - https://doi.org/10.1016/j.matdes.2008.05.058

U2 - 10.1016/j.matdes.2008.05.058

DO - 10.1016/j.matdes.2008.05.058

M3 - Article

AN - SCOPUS:57149104928

VL - 30

SP - 574

EP - 580

JO - Materials & Design

JF - Materials & Design

SN - 0261-3069

IS - 3

ER -

Indentation creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solder alloys

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this