IEEE ITRW Working Group Position Paper-Packaging and Integration: Unlocking the Full Potential of Wide-Bandgap Devices

Mark Johnson, Peter R. Wilson, Lee Empringham, Liliana De Lillo

Research output: Contribution to specialist publicationArticle

7 Citations (Scopus)

Abstract

The International Technology Roadmap for Wide-Bandgap Power Semiconductors (ITRW) has four distinct technical working groups, each providing its own perspective on the technology and industrial drivers for the adoption of wide-bandgap (WBG) power semiconductors in power electronics. This article summarizes the progress toward an initial roadmap for the packaging and integration working group of the ITRW.

Original languageEnglish
Pages26-33
Number of pages8
Volume5
No.2
Specialist publicationIEEE Power Electronics Magazine
DOIs
Publication statusPublished - 1 Jun 2018

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

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