IEEE ITRW Working Group Position Paper-Packaging and Integration: Unlocking the Full Potential of Wide-Bandgap Devices

Mark Johnson; Peter R. Wilson; Lee Empringham; Liliana De Lillo

doi:10.1109/MPEL.2018.2822246

IEEE ITRW Working Group Position Paper-Packaging and Integration: Unlocking the Full Potential of Wide-Bandgap Devices

Mark Johnson, Peter R. Wilson, Lee Empringham, Liliana De Lillo

Department of Electronic & Electrical Engineering

University of Nottingham

Research output: Contribution to specialist publication › Article

15 Citations (SciVal)

Abstract

The International Technology Roadmap for Wide-Bandgap Power Semiconductors (ITRW) has four distinct technical working groups, each providing its own perspective on the technology and industrial drivers for the adoption of wide-bandgap (WBG) power semiconductors in power electronics. This article summarizes the progress toward an initial roadmap for the packaging and integration working group of the ITRW.

Original language	English
Pages	26-33
Number of pages	8
Volume	5
No.	2
Specialist publication	IEEE Power Electronics Magazine
DOIs	https://doi.org/10.1109/MPEL.2018.2822246
Publication status	Published - 1 Jun 2018

ASJC Scopus subject areas

Control and Systems Engineering
Energy Engineering and Power Technology
Electrical and Electronic Engineering

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10.1109/MPEL.2018.2822246

Cite this

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abstract = "The International Technology Roadmap for Wide-Bandgap Power Semiconductors (ITRW) has four distinct technical working groups, each providing its own perspective on the technology and industrial drivers for the adoption of wide-bandgap (WBG) power semiconductors in power electronics. This article summarizes the progress toward an initial roadmap for the packaging and integration working group of the ITRW.",

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IEEE ITRW Working Group Position Paper-Packaging and Integration: Unlocking the Full Potential of Wide-Bandgap Devices

Abstract

ASJC Scopus subject areas

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