IEEE ITRW Working Group Position Paper-Packaging and Integration

Unlocking the Full Potential of Wide-Bandgap Devices

Mark Johnson, Peter R. Wilson, Lee Empringham, Liliana De Lillo

Research output: Contribution to specialist publicationArticle

1 Citation (Scopus)

Abstract

The International Technology Roadmap for Wide-Bandgap Power Semiconductors (ITRW) has four distinct technical working groups, each providing its own perspective on the technology and industrial drivers for the adoption of wide-bandgap (WBG) power semiconductors in power electronics. This article summarizes the progress toward an initial roadmap for the packaging and integration working group of the ITRW.

Original languageEnglish
Pages26-33
Number of pages8
Volume5
No.2
Specialist publicationIEEE Power Electronics Magazine
DOIs
Publication statusPublished - 1 Jun 2018

Fingerprint

Packaging
Energy gap
Semiconductor materials
Power electronics

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

Cite this

IEEE ITRW Working Group Position Paper-Packaging and Integration : Unlocking the Full Potential of Wide-Bandgap Devices. / Johnson, Mark; Wilson, Peter R.; Empringham, Lee; De Lillo, Liliana.

In: IEEE Power Electronics Magazine, Vol. 5, No. 2, 01.06.2018, p. 26-33.

Research output: Contribution to specialist publicationArticle

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