Focussed-ion-beam post-processing technology for active devices

Chyng Wen Tee, Fat Kit Lau, Xin Zhao, Richard Penty, Ian White

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Focused ion beam (FIB) etching technology is a highly efficient post-processing technique with the functionality to perform sputter etching and deposition of metals or insulators by means of a computer-generated mask. The high resolution and the ability to remove material directly from the sample in-situ make FIB etching the ideal candidate for device prototyping of novel micro-size photonic component design. Furthermore, the fact that arbitrary profile can be etched directly onto a sample without the need to prepare conventional mask and photolithography process makes novel device research with rapid feedback from characterisation to design activities possible. In this paper, we present a concise summary of the research work in Cambridge based on FIB technology. We demonstrate the applicability of focussed ion beam post processing technology to active photonic devices research. Applications include the integration of advanced waveguide architectures onto active photonic components. We documents details on the integration of lens structure on tapered lasers, photonic crystals on active SOA-integrated waveguides and surface profiling of low-cost gain-guided vertical-cavity surface-emitting lasers. Furthermore, we discuss additional functions of FIB in the measurement of buried waveguide structures or the integration of total-internal-reflection (TIR) mirror in optical interconnect structures.

Original languageEnglish
Title of host publicationOptoelectronic Materials and Devices
DOIs
Publication statusPublished - 27 Dec 2006
EventOptoelectronic Materials and Devices - Gwangju, Korea, Republic of
Duration: 5 Sep 20067 Sep 2006

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6352 I
ISSN (Print)0277-786X

Conference

ConferenceOptoelectronic Materials and Devices
CountryKorea, Republic of
CityGwangju
Period5/09/067/09/06

Keywords

  • Focussed ion beam etching
  • Lens structure
  • Photonic crystals
  • Photonic integration
  • Post-processing
  • Surface profiling
  • Surface relieved VCSELs
  • Waveguide structures

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Tee, C. W., Lau, F. K., Zhao, X., Penty, R., & White, I. (2006). Focussed-ion-beam post-processing technology for active devices. In Optoelectronic Materials and Devices [635210] (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 6352 I). https://doi.org/10.1117/12.691640

Focussed-ion-beam post-processing technology for active devices. / Tee, Chyng Wen; Lau, Fat Kit; Zhao, Xin; Penty, Richard; White, Ian.

Optoelectronic Materials and Devices. 2006. 635210 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 6352 I).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tee, CW, Lau, FK, Zhao, X, Penty, R & White, I 2006, Focussed-ion-beam post-processing technology for active devices. in Optoelectronic Materials and Devices., 635210, Proceedings of SPIE - The International Society for Optical Engineering, vol. 6352 I, Optoelectronic Materials and Devices, Gwangju, Korea, Republic of, 5/09/06. https://doi.org/10.1117/12.691640
Tee CW, Lau FK, Zhao X, Penty R, White I. Focussed-ion-beam post-processing technology for active devices. In Optoelectronic Materials and Devices. 2006. 635210. (Proceedings of SPIE - The International Society for Optical Engineering). https://doi.org/10.1117/12.691640
Tee, Chyng Wen ; Lau, Fat Kit ; Zhao, Xin ; Penty, Richard ; White, Ian. / Focussed-ion-beam post-processing technology for active devices. Optoelectronic Materials and Devices. 2006. (Proceedings of SPIE - The International Society for Optical Engineering).
@inproceedings{20a09190241b4be6b10103d461167de6,
title = "Focussed-ion-beam post-processing technology for active devices",
abstract = "Focused ion beam (FIB) etching technology is a highly efficient post-processing technique with the functionality to perform sputter etching and deposition of metals or insulators by means of a computer-generated mask. The high resolution and the ability to remove material directly from the sample in-situ make FIB etching the ideal candidate for device prototyping of novel micro-size photonic component design. Furthermore, the fact that arbitrary profile can be etched directly onto a sample without the need to prepare conventional mask and photolithography process makes novel device research with rapid feedback from characterisation to design activities possible. In this paper, we present a concise summary of the research work in Cambridge based on FIB technology. We demonstrate the applicability of focussed ion beam post processing technology to active photonic devices research. Applications include the integration of advanced waveguide architectures onto active photonic components. We documents details on the integration of lens structure on tapered lasers, photonic crystals on active SOA-integrated waveguides and surface profiling of low-cost gain-guided vertical-cavity surface-emitting lasers. Furthermore, we discuss additional functions of FIB in the measurement of buried waveguide structures or the integration of total-internal-reflection (TIR) mirror in optical interconnect structures.",
keywords = "Focussed ion beam etching, Lens structure, Photonic crystals, Photonic integration, Post-processing, Surface profiling, Surface relieved VCSELs, Waveguide structures",
author = "Tee, {Chyng Wen} and Lau, {Fat Kit} and Xin Zhao and Richard Penty and Ian White",
year = "2006",
month = "12",
day = "27",
doi = "10.1117/12.691640",
language = "English",
isbn = "9780819464477",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
booktitle = "Optoelectronic Materials and Devices",

}

TY - GEN

T1 - Focussed-ion-beam post-processing technology for active devices

AU - Tee, Chyng Wen

AU - Lau, Fat Kit

AU - Zhao, Xin

AU - Penty, Richard

AU - White, Ian

PY - 2006/12/27

Y1 - 2006/12/27

N2 - Focused ion beam (FIB) etching technology is a highly efficient post-processing technique with the functionality to perform sputter etching and deposition of metals or insulators by means of a computer-generated mask. The high resolution and the ability to remove material directly from the sample in-situ make FIB etching the ideal candidate for device prototyping of novel micro-size photonic component design. Furthermore, the fact that arbitrary profile can be etched directly onto a sample without the need to prepare conventional mask and photolithography process makes novel device research with rapid feedback from characterisation to design activities possible. In this paper, we present a concise summary of the research work in Cambridge based on FIB technology. We demonstrate the applicability of focussed ion beam post processing technology to active photonic devices research. Applications include the integration of advanced waveguide architectures onto active photonic components. We documents details on the integration of lens structure on tapered lasers, photonic crystals on active SOA-integrated waveguides and surface profiling of low-cost gain-guided vertical-cavity surface-emitting lasers. Furthermore, we discuss additional functions of FIB in the measurement of buried waveguide structures or the integration of total-internal-reflection (TIR) mirror in optical interconnect structures.

AB - Focused ion beam (FIB) etching technology is a highly efficient post-processing technique with the functionality to perform sputter etching and deposition of metals or insulators by means of a computer-generated mask. The high resolution and the ability to remove material directly from the sample in-situ make FIB etching the ideal candidate for device prototyping of novel micro-size photonic component design. Furthermore, the fact that arbitrary profile can be etched directly onto a sample without the need to prepare conventional mask and photolithography process makes novel device research with rapid feedback from characterisation to design activities possible. In this paper, we present a concise summary of the research work in Cambridge based on FIB technology. We demonstrate the applicability of focussed ion beam post processing technology to active photonic devices research. Applications include the integration of advanced waveguide architectures onto active photonic components. We documents details on the integration of lens structure on tapered lasers, photonic crystals on active SOA-integrated waveguides and surface profiling of low-cost gain-guided vertical-cavity surface-emitting lasers. Furthermore, we discuss additional functions of FIB in the measurement of buried waveguide structures or the integration of total-internal-reflection (TIR) mirror in optical interconnect structures.

KW - Focussed ion beam etching

KW - Lens structure

KW - Photonic crystals

KW - Photonic integration

KW - Post-processing

KW - Surface profiling

KW - Surface relieved VCSELs

KW - Waveguide structures

UR - http://www.scopus.com/inward/record.url?scp=33845667320&partnerID=8YFLogxK

U2 - 10.1117/12.691640

DO - 10.1117/12.691640

M3 - Conference contribution

SN - 9780819464477

T3 - Proceedings of SPIE - The International Society for Optical Engineering

BT - Optoelectronic Materials and Devices

ER -