Facilitating an integrated Silicon Photonics platform

G. T. Reed, Ke Li, D. J. Thomson, S. Liu, P. R. Wilson, Y. Hu, R. Topley, F. Y. Gardes, A. Z. Khokhar, S. Stanković, S. Reynolds, C. J. Mitchell, G. Martinez-Jimenez, L. O'Faolain, N. Healy, S. Mailis, A. C. Peacock, G. Z. Mashanovich

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper summarises our recent work on an integrated silicon modulator and driver to achieve up to 30Gb/s, with an extinction ratio in excess of 4dB, a fabrication tolerant multiplexer, and a device to facilitate wafer scale testing.

Original languageEnglish
Title of host publicationAsia Communications and Photonics Conference, ACPC 2015
Place of PublicationWashington, U. S. A.
PublisherOSA Publishing
ISBN (Print)9781943580064
DOIs
Publication statusPublished - 11 Dec 2015
EventAsia Communications and Photonics Conference, ACPC 2015 - , Hong Kong
Duration: 19 Nov 201523 Nov 2015

Publication series

NameAsia Communications and Photonics Conference, ACPC 2015

Conference

ConferenceAsia Communications and Photonics Conference, ACPC 2015
CountryHong Kong
Period19/11/1523/11/15

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

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  • Cite this

    Reed, G. T., Li, K., Thomson, D. J., Liu, S., Wilson, P. R., Hu, Y., Topley, R., Gardes, F. Y., Khokhar, A. Z., Stanković, S., Reynolds, S., Mitchell, C. J., Martinez-Jimenez, G., O'Faolain, L., Healy, N., Mailis, S., Peacock, A. C., & Mashanovich, G. Z. (2015). Facilitating an integrated Silicon Photonics platform. In Asia Communications and Photonics Conference, ACPC 2015 (Asia Communications and Photonics Conference, ACPC 2015). OSA Publishing. https://doi.org/10.1364/acpc.2015.asu3a.1