Facilitating an integrated Silicon Photonics platform

G. T. Reed, Ke Li, D. J. Thomson, S. Liu, P. R. Wilson, Y. Hu, R. Topley, F. Y. Gardes, A. Z. Khokhar, S. Stanković, S. Reynolds, C. J. Mitchell, G. Martinez-Jimenez, L. O'Faolain, N. Healy, S. Mailis, A. C. Peacock, G. Z. Mashanovich

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper summarises our recent work on an integrated silicon modulator and driver to achieve up to 30Gb/s, with an extinction ratio in excess of 4dB, a fabrication tolerant multiplexer, and a device to facilitate wafer scale testing.

Original languageEnglish
Title of host publicationAsia Communications and Photonics Conference, ACPC 2015
Place of PublicationWashington, U. S. A.
PublisherOSA Publishing
ISBN (Print)9781943580064
Publication statusPublished - 11 Dec 2015
EventAsia Communications and Photonics Conference, ACPC 2015 - , Hong Kong
Duration: 19 Nov 201523 Nov 2015

Conference

ConferenceAsia Communications and Photonics Conference, ACPC 2015
CountryHong Kong
Period19/11/1523/11/15

Fingerprint

Photonics
Modulators
Fabrication
Silicon
Testing

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

Cite this

Reed, G. T., Li, K., Thomson, D. J., Liu, S., Wilson, P. R., Hu, Y., ... Mashanovich, G. Z. (2015). Facilitating an integrated Silicon Photonics platform. In Asia Communications and Photonics Conference, ACPC 2015 Washington, U. S. A.: OSA Publishing.

Facilitating an integrated Silicon Photonics platform. / Reed, G. T.; Li, Ke; Thomson, D. J.; Liu, S.; Wilson, P. R.; Hu, Y.; Topley, R.; Gardes, F. Y.; Khokhar, A. Z.; Stanković, S.; Reynolds, S.; Mitchell, C. J.; Martinez-Jimenez, G.; O'Faolain, L.; Healy, N.; Mailis, S.; Peacock, A. C.; Mashanovich, G. Z.

Asia Communications and Photonics Conference, ACPC 2015. Washington, U. S. A. : OSA Publishing, 2015.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Reed, GT, Li, K, Thomson, DJ, Liu, S, Wilson, PR, Hu, Y, Topley, R, Gardes, FY, Khokhar, AZ, Stanković, S, Reynolds, S, Mitchell, CJ, Martinez-Jimenez, G, O'Faolain, L, Healy, N, Mailis, S, Peacock, AC & Mashanovich, GZ 2015, Facilitating an integrated Silicon Photonics platform. in Asia Communications and Photonics Conference, ACPC 2015. OSA Publishing, Washington, U. S. A., Asia Communications and Photonics Conference, ACPC 2015, Hong Kong, 19/11/15.
Reed GT, Li K, Thomson DJ, Liu S, Wilson PR, Hu Y et al. Facilitating an integrated Silicon Photonics platform. In Asia Communications and Photonics Conference, ACPC 2015. Washington, U. S. A.: OSA Publishing. 2015
Reed, G. T. ; Li, Ke ; Thomson, D. J. ; Liu, S. ; Wilson, P. R. ; Hu, Y. ; Topley, R. ; Gardes, F. Y. ; Khokhar, A. Z. ; Stanković, S. ; Reynolds, S. ; Mitchell, C. J. ; Martinez-Jimenez, G. ; O'Faolain, L. ; Healy, N. ; Mailis, S. ; Peacock, A. C. ; Mashanovich, G. Z. / Facilitating an integrated Silicon Photonics platform. Asia Communications and Photonics Conference, ACPC 2015. Washington, U. S. A. : OSA Publishing, 2015.
@inproceedings{c23bd303391a43f99fe12506be5d0587,
title = "Facilitating an integrated Silicon Photonics platform",
abstract = "This paper summarises our recent work on an integrated silicon modulator and driver to achieve up to 30Gb/s, with an extinction ratio in excess of 4dB, a fabrication tolerant multiplexer, and a device to facilitate wafer scale testing.",
author = "Reed, {G. T.} and Ke Li and Thomson, {D. J.} and S. Liu and Wilson, {P. R.} and Y. Hu and R. Topley and Gardes, {F. Y.} and Khokhar, {A. Z.} and S. Stanković and S. Reynolds and Mitchell, {C. J.} and G. Martinez-Jimenez and L. O'Faolain and N. Healy and S. Mailis and Peacock, {A. C.} and Mashanovich, {G. Z.}",
year = "2015",
month = "12",
day = "11",
language = "English",
isbn = "9781943580064",
booktitle = "Asia Communications and Photonics Conference, ACPC 2015",
publisher = "OSA Publishing",
address = "USA United States",

}

TY - GEN

T1 - Facilitating an integrated Silicon Photonics platform

AU - Reed, G. T.

AU - Li, Ke

AU - Thomson, D. J.

AU - Liu, S.

AU - Wilson, P. R.

AU - Hu, Y.

AU - Topley, R.

AU - Gardes, F. Y.

AU - Khokhar, A. Z.

AU - Stanković, S.

AU - Reynolds, S.

AU - Mitchell, C. J.

AU - Martinez-Jimenez, G.

AU - O'Faolain, L.

AU - Healy, N.

AU - Mailis, S.

AU - Peacock, A. C.

AU - Mashanovich, G. Z.

PY - 2015/12/11

Y1 - 2015/12/11

N2 - This paper summarises our recent work on an integrated silicon modulator and driver to achieve up to 30Gb/s, with an extinction ratio in excess of 4dB, a fabrication tolerant multiplexer, and a device to facilitate wafer scale testing.

AB - This paper summarises our recent work on an integrated silicon modulator and driver to achieve up to 30Gb/s, with an extinction ratio in excess of 4dB, a fabrication tolerant multiplexer, and a device to facilitate wafer scale testing.

UR - http://www.scopus.com/inward/record.url?scp=84971641331&partnerID=8YFLogxK

M3 - Conference contribution

SN - 9781943580064

BT - Asia Communications and Photonics Conference, ACPC 2015

PB - OSA Publishing

CY - Washington, U. S. A.

ER -