@inproceedings{c23bd303391a43f99fe12506be5d0587,
title = "Facilitating an integrated Silicon Photonics platform",
abstract = "This paper summarises our recent work on an integrated silicon modulator and driver to achieve up to 30Gb/s, with an extinction ratio in excess of 4dB, a fabrication tolerant multiplexer, and a device to facilitate wafer scale testing.",
author = "Reed, {G. T.} and Ke Li and Thomson, {D. J.} and S. Liu and Wilson, {P. R.} and Y. Hu and R. Topley and Gardes, {F. Y.} and Khokhar, {A. Z.} and S. Stankovi{\'c} and S. Reynolds and Mitchell, {C. J.} and G. Martinez-Jimenez and L. O'Faolain and N. Healy and S. Mailis and Peacock, {A. C.} and Mashanovich, {G. Z.}",
year = "2015",
month = dec,
day = "11",
doi = "10.1364/acpc.2015.asu3a.1",
language = "English",
isbn = "9781943580064",
series = "Asia Communications and Photonics Conference, ACPC 2015",
publisher = "OSA Publishing",
booktitle = "Asia Communications and Photonics Conference, ACPC 2015",
address = "USA United States",
note = "Asia Communications and Photonics Conference, ACPC 2015 ; Conference date: 19-11-2015 Through 23-11-2015",
}