Ensuring Electromagnetic Compliance in Printed Circuit Boards Through Design for Assembly Guidelines

Tom Page, Paul Baguley, Dirk Schaefer

Research output: Contribution to conferencePaper

45 Downloads (Pure)

Abstract

The aim of this work is to provide the embodiment of sample PCB design for manufacturing
and assembly rules for fine-pitch devices in a commercially PCB design application. Most
commercially used PCB design applications provide for PCB design rule-checking to an extent,
particularly in setting geometric constraints for laying out components on the substrate. For
example, in automatic placement of connectors and components within a PCB design file. The role
of the design rule checker within PCB design software is a fundamentally important in ensuring
process yield in PCB fabrication as well as ensuring functional acceptance in test whilst maintaining
accurate placement of components.
The design rules implemented in this paper emanate from a wider programme of research
that focusses on design for manufacturing and assembly issues in Surface Mount Technology
(SMT), Fine-Pitch Technology (FPT) and Flat Pack Ball-Grid Array (FPBGA). This work explores
the methodology of decision support in the design of electronic products with specific regard to
design for manufacturing and assembly. The design for manufacturing rules used in this
implementation scenario is for the precise location and placement of Fine-pitch components.
Original languageEnglish
Pages106
Number of pages110
Publication statusPublished - 2004
EventECAD/ECAE2004 – 1st International Conference on Electrical/Electro¬mechanical Computer-Aided Design & Engineering - Durham, UK United Kingdom
Duration: 15 Nov 200416 Nov 2004

Conference

ConferenceECAD/ECAE2004 – 1st International Conference on Electrical/Electro¬mechanical Computer-Aided Design & Engineering
CountryUK United Kingdom
CityDurham
Period15/11/0416/11/04

    Fingerprint

Keywords

  • PCB
  • E-CAD

Cite this

Page, T., Baguley, P., & Schaefer, D. (2004). Ensuring Electromagnetic Compliance in Printed Circuit Boards Through Design for Assembly Guidelines. 106. Paper presented at ECAD/ECAE2004 – 1st International Conference on Electrical/Electro¬mechanical Computer-Aided Design & Engineering, Durham, UK United Kingdom.