Electromagnetic compatibility analysis of multilayer PCBs using a hybrid finite difference time domain (FDTD) - Partial element equivalent circuit (PEEC) method

M. J. Cryan, I. J. Craddock, R. V. Penty, C. J. Railton, I. H. White

Research output: Contribution to conferencePaper

2 Citations (Scopus)

Abstract

A hybrid FDTD/PEEC method is used to analyse radiation from multilayer PCBs. A Huygen's surface is obtained from the PEEC method that can be used as an excitation for a traditional FDTD simulation from which radiation patterns, and hence EMC/EMI performance, can be obtained. The use of the Huygen's excitation will remove the necessity to place 3 or 4 FDTD cells across the thin PCB tracks resulting in much reduced simulation times. Comparisons between pure FDTD and the hybrid method are shown for the simple case of a 50 microstrip line and good agreement is obtained for current distributions and radiation patterns. A pure FDTD simulation of a complex, multilayer PCB used in a 2.5Gb/s optical transceiver is carried out and initial results are presented.

Original languageEnglish
DOIs
Publication statusPublished - 1 Jan 2001
Event2001 31st European Microwave Conference, EuMC 2001 - London, UK United Kingdom
Duration: 24 Sep 200126 Sep 2001

Conference

Conference2001 31st European Microwave Conference, EuMC 2001
CountryUK United Kingdom
CityLondon
Period24/09/0126/09/01

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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