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Dive into the research topics of 'Effects of the Encapsulating Resin on the Junction Temperature of the QFN16 and QFN32 Electronic Packages Subjected to Free Convection'. Together they form a unique fingerprint.
Mathematics
Free Convection
Electronics
Conductivity
Horizontal
Control Volume
Inclination
Thermal Conductivity
Exponential Type
Prototype
Trends
Vertical
Exceed
Influence
Three-dimensional
Numerical Solution
Formulation
Range of data
Relationships
Performance
Physics & Astronomy
encapsulating
free convection
resins
electronics
temperature
malfunctions
conductivity
low conductivity
inclination
prototypes
thermal conductivity
trends
formulations
performance
Engineering & Materials Science
Natural convection
Resins
Temperature
Hot Temperature
Lead
Thermal conductivity
Chemical Compounds
Natural convection
Resins
Temperature
Hot Temperature
Lead
Thermal conductivity