Effect of two relative humidity environments on the performance properties of MDF, OSB and chipboard. Part 2. Fatigue and creep performance

The fatigue and creep performance of MDF, OSB and chipboard have been examined in two environments, namely 65%RH (standard environment) and 85%RH (high humidity). Parallel fatigue and creep tests have been performed in four-point bending on the three wood-based panel products in the two environments. The constant 65%RH environment is service class 1 and the constant 85% RH environment is indicative of a service class 2 environment as detailed in Eurocode 5. The non-interruptive technique of stress-strain hysteresis loop capture has been utilised to follow property changes of the fatigue samples during cyclic loading at a stress ratio of R equal to 0.1. Loop parameters such as loop area, dynamic modulus, and fatigue modulus have been used to characterise the response of these materials to fatigue loads in the two environments. Creep microstrains for the creep samples were recorded in parallel with the fatigue parameters. Fatigue and creep results at 85%RH were more variable than those reported at 65%RH for MDF, OSB and chipboard. In general, at R = 0.1 and 85%RH, fatigue and creep microstrains were higher, dynamic stiffnesses were lower and hysteresis loop areas were higher than corresponding properties measured at 65%RH. MDF and chipboard were less moisture tolerant than OSB, this is reflected in the large changes in fatigue and creep parameters.