Creep of thixotropic adhesives in bonded-in timber connections as a function of temperature and humidity

Adlin Roseley, M.P. Ansell, D. Smedley, S. Porter

Research output: Chapter in Book/Report/Conference proceedingOther chapter contribution

2 Citations (Scopus)

Abstract

Thixotropic, shear-thinning epoxy adhesives are the optimum choice for in situ assembly of timber structural joints under ambient conditions. These adhesives are suitable for injection into roof members and under bridge decks where gravity is a problem for conventional adhesives. However these ambient cure adhesives possess relatively low glass transition temperatures (Tg) and there are concerns associated with their stability under creep loads in conditions of high temperature and humidity. These concerns have been addressed in a paper presented at WCTE 2010 and in a subsequent journal publication where creep data generated in a dynamic mechanical thermal analyser (DMTA) has demonstrated the stability of these adhesives above Tg. In this paper results of creep tests on bonded-in connections, at a design shear stress of 2N/mm2 at the rod to adhesive interface, arc presented at temperatures of 20,30, 40 and SOX with levels of relative humidity (RH) of 65,75,85 and 95%. Creep experiments were conducted in a walk- in environmental chamber and creep was followed with laser displacement sensors. At intermediate combinations of temperature and RH level (e.g. 30°C, 75%RH), secondary creep was observed up to a limit. Under extreme conditions of high temperature and RH tertiary creep to failure occurred.
Original languageEnglish
Title of host publicationWorld Conference on Timber Engineering 2012, WCTE 2012
Pages377-378
Number of pages2
Volume5
Publication statusPublished - 2012
Event12th World Conference on Timber Engineering - Auckland, New Zealand
Duration: 15 Jul 201219 Jul 2012

Conference

Conference12th World Conference on Timber Engineering
CountryNew Zealand
CityAuckland
Period15/07/1219/07/12

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  • Cite this

    Roseley, A., Ansell, M. P., Smedley, D., & Porter, S. (2012). Creep of thixotropic adhesives in bonded-in timber connections as a function of temperature and humidity. In World Conference on Timber Engineering 2012, WCTE 2012 (Vol. 5, pp. 377-378)