Combined studies of surface evolution and crack healing for the suppression of negative factors during CO2laser repairing of fused silica

Chao Tan, Linjie Zhao, Mingjun Chen, Jian Cheng, Zhaoyang Yin, Qi Liu, Hao Yang, Wei Liao

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7 Citations (SciVal)

Abstract

In order to reveal the evolution mechanism of repaired morphology and the material's migration mechanism on the crack surface in the process of CO2laser repairing surface damage of fused silica optics, two multi-physics coupling mathematical models with different scales are developed, respectively. The physical problems, such as heat and mass transfer, material phase transition, melt flow, evaporation removal, and crack healing, are analyzed. Studies show that material ablation and the gasification recoil pressure accompanying the material splash are the leading factors in forming the Gaussian crater with a raised rim feature. The use of low-power lasers for a long time can fully melt the material around the crack before healing, which can greatly reduce the size of the residual air layer. Combined with the experimental research, the methods to suppress the negative factors (e.g., raised rim, deposited debris, air bubbles) in the CO2laser repairing process are proposed.

Original languageEnglish
Article number041402
JournalChinese Optics Letters
Volume19
Issue number4
DOIs
Publication statusPublished - 10 Apr 2021

Funding

This work was supported by the National Natural Science Foundation of China (Nos. 51775147 and 51705105), Science Challenge Project (No. TZ2016006-0503-01), and Young Elite Scientists Sponsorship Program by CAST (No. 2018QNRC001).

FundersFunder number
National Natural Science Foundation of China51705105, 51775147
China Academy of Space Technology2018QNRC001
Science Challenge Project of ChinaTZ2016006-0503-01

    Keywords

    • COlaser repairing
    • Crack healing
    • Fused silica
    • Surface evolution

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Atomic and Molecular Physics, and Optics
    • Electrical and Electronic Engineering

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