Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters

Ke Li; D. J. Thomson; Shenghao Liu; Fanfan Meng; Abdul Shakoor; Ali Khokhar; Wei Cao; Weiwei Zhang; Peter Wilson; G. T. Reed

doi:10.1109/ECOC.2018.8535212

Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters

Ke Li, D. J. Thomson, Shenghao Liu, Fanfan Meng, Abdul Shakoor, Ali Khokhar, Wei Cao, Weiwei Zhang, Peter Wilson, G. T. Reed

Research output: Chapter in Book/Report/Conference proceeding › Chapter in a published conference proceeding

5 Citations (SciVal)

Abstract

Synergistic design of a CMOS driver and a depletion type Si MZM has been illustrated from circuit level design to real chip tape-out. The compact wire-bonded transmitter achieves 1.5pJ/bit power efficiency at 22Gb/s, provided 3.0dB extinction raio is maintained.

Original language	English
Title of host publication	2018 European Conference on Optical Communication, ECOC 2018
Publisher	IEEE
Volume	2018-September
ISBN (Electronic)	9781538648629
DOIs	https://doi.org/10.1109/ECOC.2018.8535212
Publication status	Published - 14 Nov 2018
Event	2018 European Conference on Optical Communication, ECOC 2018 - Rome, Italy Duration: 23 Sep 2018 → 27 Sep 2018

Conference

Conference	2018 European Conference on Optical Communication, ECOC 2018
Country/Territory	Italy
City	Rome
Period	23/09/18 → 27/09/18

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

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10.1109/ECOC.2018.8535212

Cite this

Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters. / Li, Ke; Thomson, D. J.; Liu, Shenghao; Meng, Fanfan; Shakoor, Abdul; Khokhar, Ali; Cao, Wei; Zhang, Weiwei; Wilson, Peter; Reed, G. T.

2018 European Conference on Optical Communication, ECOC 2018. Vol. 2018-September IEEE, 2018. 8535212.

Research output: Chapter in Book/Report/Conference proceeding › Chapter in a published conference proceeding

Li, K, Thomson, DJ, Liu, S, Meng, F, Shakoor, A, Khokhar, A, Cao, W, Zhang, W, Wilson, P & Reed, GT 2018, Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters. in 2018 European Conference on Optical Communication, ECOC 2018. vol. 2018-September, 8535212, IEEE, 2018 European Conference on Optical Communication, ECOC 2018, Rome, Italy, 23/09/18. https://doi.org/10.1109/ECOC.2018.8535212

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AU - Zhang, Weiwei

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AU - Reed, G. T.

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Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters

Abstract

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ASJC Scopus subject areas

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