Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters

Ke Li; D. J. Thomson; Shenghao Liu; Fanfan Meng; Abdul Shakoor; Ali Khokhar; Wei Cao; Weiwei Zhang; Peter Wilson; G. T. Reed

doi:10.1109/ECOC.2018.8535212

Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters

Ke Li, D. J. Thomson, Shenghao Liu, Fanfan Meng, Abdul Shakoor, Ali Khokhar, Wei Cao, Weiwei Zhang, Peter Wilson, G. T. Reed

Department of Electronic & Electrical Engineering

University of Southampton

Research output: Chapter or section in a book/report/conference proceeding › Chapter in a published conference proceeding

8 Citations (SciVal)

Abstract

Synergistic design of a CMOS driver and a depletion type Si MZM has been illustrated from circuit level design to real chip tape-out. The compact wire-bonded transmitter achieves 1.5pJ/bit power efficiency at 22Gb/s, provided 3.0dB extinction raio is maintained.

Original language	English
Title of host publication	2018 European Conference on Optical Communication, ECOC 2018
Publisher	IEEE
Volume	2018-September
ISBN (Electronic)	9781538648629
DOIs	https://doi.org/10.1109/ECOC.2018.8535212
Publication status	Published - 14 Nov 2018
Event	2018 European Conference on Optical Communication, ECOC 2018 - Rome, Italy Duration: 23 Sept 2018 → 27 Sept 2018

Conference

Conference	2018 European Conference on Optical Communication, ECOC 2018
Country/Territory	Italy
City	Rome
Period	23/09/18 → 27/09/18

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/ECOC.2018.8535212

Cite this

Li, K, Thomson, DJ, Liu, S, Meng, F, Shakoor, A, Khokhar, A, Cao, W, Zhang, W, Wilson, P & Reed, GT 2018, Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters. in 2018 European Conference on Optical Communication, ECOC 2018. vol. 2018-September, 8535212, IEEE, 2018 European Conference on Optical Communication, ECOC 2018, Rome, Italy, 23/09/18. https://doi.org/10.1109/ECOC.2018.8535212

@inproceedings{e5b7b21cc8224659ae41a30684a22b90,

title = "Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters",

abstract = "Synergistic design of a CMOS driver and a depletion type Si MZM has been illustrated from circuit level design to real chip tape-out. The compact wire-bonded transmitter achieves 1.5pJ/bit power efficiency at 22Gb/s, provided 3.0dB extinction raio is maintained.",

author = "Ke Li and Thomson, {D. J.} and Shenghao Liu and Fanfan Meng and Abdul Shakoor and Ali Khokhar and Wei Cao and Weiwei Zhang and Peter Wilson and Reed, {G. T.}",

year = "2018",

month = nov,

day = "14",

doi = "10.1109/ECOC.2018.8535212",

language = "English",

volume = "2018-September",

booktitle = "2018 European Conference on Optical Communication, ECOC 2018",

publisher = "IEEE",

address = "USA United States",

note = "2018 European Conference on Optical Communication, ECOC 2018 ; Conference date: 23-09-2018 Through 27-09-2018",

}

TY - GEN

T1 - Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters

AU - Li, Ke

AU - Thomson, D. J.

AU - Liu, Shenghao

AU - Meng, Fanfan

AU - Shakoor, Abdul

AU - Khokhar, Ali

AU - Cao, Wei

AU - Zhang, Weiwei

AU - Wilson, Peter

AU - Reed, G. T.

PY - 2018/11/14

Y1 - 2018/11/14

N2 - Synergistic design of a CMOS driver and a depletion type Si MZM has been illustrated from circuit level design to real chip tape-out. The compact wire-bonded transmitter achieves 1.5pJ/bit power efficiency at 22Gb/s, provided 3.0dB extinction raio is maintained.

AB - Synergistic design of a CMOS driver and a depletion type Si MZM has been illustrated from circuit level design to real chip tape-out. The compact wire-bonded transmitter achieves 1.5pJ/bit power efficiency at 22Gb/s, provided 3.0dB extinction raio is maintained.

UR - http://www.scopus.com/inward/record.url?scp=85063211403&partnerID=8YFLogxK

U2 - 10.1109/ECOC.2018.8535212

DO - 10.1109/ECOC.2018.8535212

M3 - Chapter in a published conference proceeding

AN - SCOPUS:85063211403

VL - 2018-September

BT - 2018 European Conference on Optical Communication, ECOC 2018

PB - IEEE

T2 - 2018 European Conference on Optical Communication, ECOC 2018

Y2 - 23 September 2018 through 27 September 2018

ER -

Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters

Abstract

Conference

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this