Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters

Ke Li, D. J. Thomson, Shenghao Liu, Fanfan Meng, Abdul Shakoor, Ali Khokhar, Wei Cao, Weiwei Zhang, Peter Wilson, G. T. Reed

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Synergistic design of a CMOS driver and a depletion type Si MZM has been illustrated from circuit level design to real chip tape-out. The compact wire-bonded transmitter achieves 1.5pJ/bit power efficiency at 22Gb/s, provided 3.0dB extinction raio is maintained.

Original languageEnglish
Title of host publication2018 European Conference on Optical Communication, ECOC 2018
PublisherIEEE
Volume2018-September
ISBN (Electronic)9781538648629
DOIs
Publication statusPublished - 14 Nov 2018
Event2018 European Conference on Optical Communication, ECOC 2018 - Rome, Italy
Duration: 23 Sep 201827 Sep 2018

Conference

Conference2018 European Conference on Optical Communication, ECOC 2018
CountryItaly
CityRome
Period23/09/1827/09/18

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Li, K., Thomson, D. J., Liu, S., Meng, F., Shakoor, A., Khokhar, A., Cao, W., Zhang, W., Wilson, P., & Reed, G. T. (2018). Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters. In 2018 European Conference on Optical Communication, ECOC 2018 (Vol. 2018-September). [8535212] IEEE. https://doi.org/10.1109/ECOC.2018.8535212