Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters

Ke Li; D. J. Thomson; Shenghao Liu; Fanfan Meng; Abdul Shakoor; Ali Khokhar; Wei Cao; Weiwei Zhang; Peter Wilson; G. T. Reed

doi:10.1109/ECOC.2018.8535212

Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters

Ke Li, D. J. Thomson, Shenghao Liu, Fanfan Meng, Abdul Shakoor, Ali Khokhar, Wei Cao, Weiwei Zhang, Peter Wilson, G. T. Reed

Department of Electronic & Electrical Engineering

University of Southampton

Research output: Chapter or section in a book/report/conference proceeding › Chapter in a published conference proceeding

8 Citations (SciVal)

Abstract

Synergistic design of a CMOS driver and a depletion type Si MZM has been illustrated from circuit level design to real chip tape-out. The compact wire-bonded transmitter achieves 1.5pJ/bit power efficiency at 22Gb/s, provided 3.0dB extinction raio is maintained.

Original language	English
Title of host publication	2018 European Conference on Optical Communication, ECOC 2018
Publisher	IEEE
Volume	2018-September
ISBN (Electronic)	9781538648629
DOIs	https://doi.org/10.1109/ECOC.2018.8535212
Publication status	Published - 14 Nov 2018
Event	2018 European Conference on Optical Communication, ECOC 2018 - Rome, Italy Duration: 23 Sept 2018 → 27 Sept 2018

Conference

Conference	2018 European Conference on Optical Communication, ECOC 2018
Country/Territory	Italy
City	Rome
Period	23/09/18 → 27/09/18

Funding

G.T.Reed is a Royal Society Wolfson Merit Award holder and is grateful to both the Royal Society and the Wolfson Foundation for funding the award. D.J.Thomson acknowledges funding from the Royal Society for his University Research Fellowship. This work is supported by EPSRC Programme Grant (EP/L00044X/1).

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

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10.1109/ECOC.2018.8535212

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Li, K, Thomson, DJ, Liu, S, Meng, F, Shakoor, A, Khokhar, A, Cao, W, Zhang, W, Wilson, P & Reed, GT 2018, Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters. in 2018 European Conference on Optical Communication, ECOC 2018. vol. 2018-September, 8535212, IEEE, 2018 European Conference on Optical Communication, ECOC 2018, Rome, Italy, 23/09/18. https://doi.org/10.1109/ECOC.2018.8535212

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AU - Khokhar, Ali

AU - Cao, Wei

AU - Zhang, Weiwei

AU - Wilson, Peter

AU - Reed, G. T.

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AB - Synergistic design of a CMOS driver and a depletion type Si MZM has been illustrated from circuit level design to real chip tape-out. The compact wire-bonded transmitter achieves 1.5pJ/bit power efficiency at 22Gb/s, provided 3.0dB extinction raio is maintained.

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Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters

Abstract

Conference

Funding

ASJC Scopus subject areas

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