Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters

Ke Li, D. J. Thomson, Shenghao Liu, Fanfan Meng, Abdul Shakoor, Ali Khokhar, Wei Cao, Weiwei Zhang, Peter Wilson, G. T. Reed

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Synergistic design of a CMOS driver and a depletion type Si MZM has been illustrated from circuit level design to real chip tape-out. The compact wire-bonded transmitter achieves 1.5pJ/bit power efficiency at 22Gb/s, provided 3.0dB extinction raio is maintained.

Original languageEnglish
Title of host publication2018 European Conference on Optical Communication, ECOC 2018
PublisherIEEE
Volume2018-September
ISBN (Electronic)9781538648629
DOIs
Publication statusPublished - 14 Nov 2018
Event2018 European Conference on Optical Communication, ECOC 2018 - Rome, Italy
Duration: 23 Sep 201827 Sep 2018

Conference

Conference2018 European Conference on Optical Communication, ECOC 2018
CountryItaly
CityRome
Period23/09/1827/09/18

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Li, K., Thomson, D. J., Liu, S., Meng, F., Shakoor, A., Khokhar, A., ... Reed, G. T. (2018). Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters. In 2018 European Conference on Optical Communication, ECOC 2018 (Vol. 2018-September). [8535212] IEEE. https://doi.org/10.1109/ECOC.2018.8535212

Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters. / Li, Ke; Thomson, D. J.; Liu, Shenghao; Meng, Fanfan; Shakoor, Abdul; Khokhar, Ali; Cao, Wei; Zhang, Weiwei; Wilson, Peter; Reed, G. T.

2018 European Conference on Optical Communication, ECOC 2018. Vol. 2018-September IEEE, 2018. 8535212.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Li, K, Thomson, DJ, Liu, S, Meng, F, Shakoor, A, Khokhar, A, Cao, W, Zhang, W, Wilson, P & Reed, GT 2018, Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters. in 2018 European Conference on Optical Communication, ECOC 2018. vol. 2018-September, 8535212, IEEE, 2018 European Conference on Optical Communication, ECOC 2018, Rome, Italy, 23/09/18. https://doi.org/10.1109/ECOC.2018.8535212
Li K, Thomson DJ, Liu S, Meng F, Shakoor A, Khokhar A et al. Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters. In 2018 European Conference on Optical Communication, ECOC 2018. Vol. 2018-September. IEEE. 2018. 8535212 https://doi.org/10.1109/ECOC.2018.8535212
Li, Ke ; Thomson, D. J. ; Liu, Shenghao ; Meng, Fanfan ; Shakoor, Abdul ; Khokhar, Ali ; Cao, Wei ; Zhang, Weiwei ; Wilson, Peter ; Reed, G. T. / Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters. 2018 European Conference on Optical Communication, ECOC 2018. Vol. 2018-September IEEE, 2018.
@inproceedings{e5b7b21cc8224659ae41a30684a22b90,
title = "Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters",
abstract = "Synergistic design of a CMOS driver and a depletion type Si MZM has been illustrated from circuit level design to real chip tape-out. The compact wire-bonded transmitter achieves 1.5pJ/bit power efficiency at 22Gb/s, provided 3.0dB extinction raio is maintained.",
author = "Ke Li and Thomson, {D. J.} and Shenghao Liu and Fanfan Meng and Abdul Shakoor and Ali Khokhar and Wei Cao and Weiwei Zhang and Peter Wilson and Reed, {G. T.}",
year = "2018",
month = "11",
day = "14",
doi = "10.1109/ECOC.2018.8535212",
language = "English",
volume = "2018-September",
booktitle = "2018 European Conference on Optical Communication, ECOC 2018",
publisher = "IEEE",
address = "USA United States",

}

TY - GEN

T1 - Co-Design of Electronics and Photonics Components for Silicon Photonics Transmitters

AU - Li, Ke

AU - Thomson, D. J.

AU - Liu, Shenghao

AU - Meng, Fanfan

AU - Shakoor, Abdul

AU - Khokhar, Ali

AU - Cao, Wei

AU - Zhang, Weiwei

AU - Wilson, Peter

AU - Reed, G. T.

PY - 2018/11/14

Y1 - 2018/11/14

N2 - Synergistic design of a CMOS driver and a depletion type Si MZM has been illustrated from circuit level design to real chip tape-out. The compact wire-bonded transmitter achieves 1.5pJ/bit power efficiency at 22Gb/s, provided 3.0dB extinction raio is maintained.

AB - Synergistic design of a CMOS driver and a depletion type Si MZM has been illustrated from circuit level design to real chip tape-out. The compact wire-bonded transmitter achieves 1.5pJ/bit power efficiency at 22Gb/s, provided 3.0dB extinction raio is maintained.

UR - http://www.scopus.com/inward/record.url?scp=85063211403&partnerID=8YFLogxK

U2 - 10.1109/ECOC.2018.8535212

DO - 10.1109/ECOC.2018.8535212

M3 - Conference contribution

VL - 2018-September

BT - 2018 European Conference on Optical Communication, ECOC 2018

PB - IEEE

ER -