TY - JOUR
T1 - Characterization of spin-on zeolite films prepared from Silicalite-1 nanoparticle suspensions
AU - Eslava, S
AU - Kirschhock, C.E.A.
AU - Aldea, S.
AU - Baklanov, M.R.
AU - Iacopi, F.
AU - Maex, K.
AU - Martens, J.A.
PY - 2009/2/1
Y1 - 2009/2/1
N2 - Spin-on porous films were prepared on silicon wafers using Silicalite-1 nanozeolite suspensions crystallized from clear solution. The content and size of Silicalite-1 nanocrystals and of residual ∼2-4 nm nanoparticles in the starting suspensions were varied by varying the crystallization time. The films were characterized using scanning electron microscopy, X-ray diffraction, spectroscopic ellipsometry, atomic force microscopy, Fourier transform infrared spectroscopy, ellipsometric porosimetry, impedance analysis and nanoindentation. All the properties of spin-on Silicalite-1 films strongly depended on the composition of the Silicalite-1 suspensions spun onto the support. With increasing Silicalite-1 nanocrystal content, crystallinity, hydrophobicity and porosity increased, while elastic modulus, homogeneity, roughness, and dielectric constant decreased. Their implementation in on-chip interconnects is discussed.
AB - Spin-on porous films were prepared on silicon wafers using Silicalite-1 nanozeolite suspensions crystallized from clear solution. The content and size of Silicalite-1 nanocrystals and of residual ∼2-4 nm nanoparticles in the starting suspensions were varied by varying the crystallization time. The films were characterized using scanning electron microscopy, X-ray diffraction, spectroscopic ellipsometry, atomic force microscopy, Fourier transform infrared spectroscopy, ellipsometric porosimetry, impedance analysis and nanoindentation. All the properties of spin-on Silicalite-1 films strongly depended on the composition of the Silicalite-1 suspensions spun onto the support. With increasing Silicalite-1 nanocrystal content, crystallinity, hydrophobicity and porosity increased, while elastic modulus, homogeneity, roughness, and dielectric constant decreased. Their implementation in on-chip interconnects is discussed.
UR - http://www.scopus.com/inward/record.url?scp=57649233534&partnerID=8YFLogxK
UR - http:/dx.doi.org/10.1016/j.micromeso.2008.09.027
U2 - 10.1016/j.micromeso.2008.09.027
DO - 10.1016/j.micromeso.2008.09.027
M3 - Article
AN - SCOPUS:57649233534
SN - 1387-1811
VL - 118
SP - 458
EP - 466
JO - Microporous and Mesoporous Materials
JF - Microporous and Mesoporous Materials
IS - 1-3
ER -