Characterisation of austenitic 316LSi stainless steel produced by wire arc additive manufacturing with interlayer cooling

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Abstract

Wire arc additive manufacturing (WAAM) expands the possibilities of cost effectively producing large-scale, complex metal objects at high deposition rates. However, the variation in the WAAM process parameters is not well understood, despite greatly affecting the materials properties, part functionality and the economics of WAAM production. Austenitic stainless steel is a commonly used material and has many applications in the marine and nuclear industry due to its high toughness and corrosion resistance. In this research, the effects of the interpass temperature and heat input process parameters on WAAM of austenitic AISI 316LSi stainless steel are experimentally analysed and evaluated. It was found that the heat input and interpass temperature influences the cellular/dendritic morphology and the formation of macro-scale grains within the microstructure. Additionally, use of higher heat input, resulted in a 28.7% improvement in average Young’s modulus compared to lower heat input, although this remained lower than provided by wrought annealed material.
Original languageEnglish
Title of host publicationInternational Solid Freeform Fabrication Symposium – An Additive Manufacturing Conference Proceedings
Publication statusPublished - 1 Nov 2019
EventSolid Freeform Fabrication 2019: Proceedings of the 30th Annual International
Solid Freeform Fabrication Symposium – An Additive Manufacturing Conference
- Hilton Austin, Austin, USA United States
Duration: 12 Aug 201914 Aug 2019
https://sffsymposium.engr.utexas.edu/

Publication series

NameInternational Solid Freeform Fabrication Symposium – An Additive Manufacturing Conference Proceedings

Conference

ConferenceSolid Freeform Fabrication 2019: Proceedings of the 30th Annual International
Solid Freeform Fabrication Symposium – An Additive Manufacturing Conference
Country/TerritoryUSA United States
CityAustin
Period12/08/1914/08/19
Internet address

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