Assessing student satisfaction in transnational higher education

Stephen Wilkins, Melodena Stephens Balakrishnan

Research output: Contribution to journalArticlepeer-review

163 Citations (SciVal)
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Abstract

Purpose – Given that there exists in the literature relatively little research into student experiences in transnational higher education, the purpose of this paper is to identify the determinants of student satisfaction at international branch campuses in the United Arab Emirates (UAE).

Design/methodology/approach – This quantitative study involved 247 undergraduate and postgraduate students at branch campuses in the UAE who completed a questionnaire using either hard copies or an online version.

Findings – It was found that levels of student satisfaction at UAE branch campuses were generally high. The factors that were most influential in determining whether or not a student at a UAE branch campus was satisfied overall with their institution were quality of lecturers, quality and availability of resources, and effective use of technology.

Research limitations/implications – Given that cultures, customs, traditions and social contexts vary considerably in different locations, the findings of this study are not generalisable across all international branch campuses globally.

Practical implications – The findings indicate that there remains scope for UAE branch campuses to further increase levels of student satisfaction. Managers might use the findings to review their own institution's performance, so that areas for improvement can be identified.

Originality/value – Given that the logit model developed had an 87.4 per cent success rate in predicting whether or not a student at a UAE branch campus was satisfied overall with their institution, this research has demonstrated the potential usefulness of logistic regression as a predictive and explanatory tool in education management.
Original languageEnglish
Pages (from-to)143-156
Number of pages13
JournalInternational Journal of Educational Management
Volume27
Issue number2
DOIs
Publication statusPublished - Feb 2013

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