Abstract
A silver-olefin based coordination polymer was prepared in a simple, one step process to act as an initiator to facilitate the ring-opening polymerization of epoxides. Thermal analysis found the complex to be capable of curing a range of commercially available epoxy resins used in the manufacture of conventional composite materials. Curing of the oligomeric diglycidyl ether bisphenol A resin, Epon 828, in combination with a non-toxic solvent, ethyl phenylacetate, was studied by differential scanning calorimetry. The mechanical characterization of the resultant cured polymers was conducted by single lap shear tests. Tapered double cantilever beam (TDCB) test specimens containing 2.5 pph of silver-olefin initiator, both with and without embedded microcapsules, were analyzed for their healing performance. Healing efficiency values were found to be strongly dependent on the applied healing temperature. A mean recovery of 74% fracture load was found in TDCB samples after being healed at 70 °C for 48 h.
| Original language | English |
|---|---|
| Article number | 055004 |
| Journal | Smart Materials and Structures |
| Volume | 24 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - 1 May 2015 |
Keywords
- epoxy resins
- microcapsules
- self-healing
ASJC Scopus subject areas
- General Materials Science
- Mechanics of Materials
- Condensed Matter Physics
- Civil and Structural Engineering
- Atomic and Molecular Physics, and Optics
- Electrical and Electronic Engineering
- Signal Processing