A state-of-the-art review of micron-scale spatially resolved residual stress analysis by FIB-DIC ring-core milling and other techniques

Alexander J.G. Lunt, Nikolaos Baimpas, Enrico Salvati, Igor P. Dolbnya, Tan Sui, Siqi Ying, Hongjia Zhang, Annette K. Kleppe, Jiri Dluhoš, Alexander M. Korsunsky

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Quantification of residual stress gradients can provide great improvements in understanding the complex interactions between microstructure, mechanical state, mode(s) of failure and structural integrity. Highly focused local probe non-destructive techniques such as X-ray diffraction, electron diffraction or Raman spectroscopy have an established track record in determining spatial variations in the relative changes in residual stress with respect to a reference state for many structural materials. However, the interpretation of these measurements in terms of absolute stress values requires a strain-free sample often difficult to obtain due to the influence of chemistry, microstructure or processing route. With the increasing availability of focused ion beam instruments, a new approach has been developed which is known as the micro-scale ring-core focused ion beam-digital image correlation technique. This technique is becoming the principal tool for quantifying absolute in-plane residual stresses. It can be applied to a broad range of materials: crystalline and amorphous metallic alloys and ceramics, polymers, composites and biomaterials. The precise nano-scale positioning and well-defined gauge volume of this experimental technique make it eminently suitable for spatially resolved analysis, that is, residual stress profiling and mapping. Following a summary of micro-stress evaluation approaches, we focus our attention on focused ion beam-digital image correlation methods and assess the application of micro-scale ring-core methods for spatially resolved residual stress profiling. The sequential ring-core milling focused ion beam-digital image correlation method allows micro- to macro-scale mapping at the step of 10-1000 μm, while the parallel focused ion beam-digital image correlation approach exploits simultaneous milling operation to quantify stress profiles at the micron scale (1-10 μm). Cross-validation against X-ray diffraction results confirms that these approaches represent accurate, reliable and effective residual stress mapping methods.

Original languageEnglish
Pages (from-to)426-444
Number of pages19
JournalJournal of Strain Analysis for Engineering Design
Issue number7
Early online date4 Aug 2015
Publication statusPublished - 1 Oct 2015


  • digital image correlation
  • focused ion beam
  • micro-scale
  • Residual stress
  • ring-core
  • X-ray diffraction

ASJC Scopus subject areas

  • Modelling and Simulation
  • Mechanics of Materials
  • Mechanical Engineering
  • Applied Mathematics


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