Abstract
The elastic response of a thin film of photoresist deposited on a silicon wafer is studied by using a shaft-loaded blister test method developed recently. Experiment data are compared with an analytical solution. Results demonstrated that under shaft loading, the thin film underwent a pure bending mode at small deformation and gradually transformed to a pure stretching mode at larger deformation. The effect of residual stress on elastic response is also studied. The delamination of thin film from substrate can be successfully measured under displacement control mode by the shaft-loaded blister test.
| Original language | English |
|---|---|
| Pages (from-to) | 115-119 |
| Number of pages | 5 |
| Journal | Thin Solid Films |
| Volume | 424 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 22 Jan 2003 |
| Event | proceedings of the 1st Ineternational Conference on Materials - Singapore, Singapore Duration: 1 Jul 2001 → 6 Jul 2001 |
Keywords
- Delamination
- Mechanics of thin film
- Shaft-loaded blister test
- Thin film
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Surfaces and Interfaces
- Surfaces, Coatings and Films
- Metals and Alloys
- Materials Chemistry