A new application area for 3D ECT in non-destructive evaluation of dielectric materials

R Banasiak, R Wajman, J Betiuk, Manuchehr Soleimani

Research output: Contribution to conferencePaperpeer-review

Abstract

Electrical capacitance tomography (ECT) is relatively mature imaging technique. There has been tremendous improvement in 2D ECT. Three dimensional ECT is now gaining more interests, since some of the computational difficulties dealing with the forward and inverse problems of 3D ECT. At the same time the application areas for ECT are expanding in many different areas of science and technology. The main area of application is the industrial process tomography. In this paper we demonstrate the application of 3D in another very important area, inspection of dielectric materials. We report a new ECT sensor we have developed for this purpose and present some reconstruction results. During experimental stage new numerical sensor model has been developed using FEM modelling.
Original languageEnglish
Publication statusPublished - Apr 2009
Event3rd International Workshop on Process Tomography - Tokyo, Japan
Duration: 17 Apr 200919 Apr 2009

Conference

Conference3rd International Workshop on Process Tomography
Country/TerritoryJapan
CityTokyo
Period17/04/0919/04/09

Fingerprint

Dive into the research topics of 'A new application area for 3D ECT in non-destructive evaluation of dielectric materials'. Together they form a unique fingerprint.

Cite this