A comparison of impression, indentation and impression-relaxation creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solders at room temperature

R. Mahmudi, A. R. Geranmayeh, H. Noori, H. Khanbareh, N. Jahangiri

Research output: Contribution to journalArticle

16 Citations (Scopus)

Abstract

Creep behavior of Sn-9% Zn and Sn-8% Zn-3% Bi solder alloys was studied by impression, indentation, and impression-relaxation tests at room temperature (T > 0.6 T m) in order to evaluate the correspondence of the creep results obtained by different testing techniques, and to evaluate the effect of Bi on the creep response of the eutectic Sn - 9Zn alloy. Stress exponent values were determined through these methods and in all cases the calculated exponents were in good agreement. The average stress exponents of 8.6 and 9.9, found respectively for the binary and ternary alloys, are close to those determined by room temperature conventional creep testing of the same materials reported in the literature. These exponents imply that dislocation creep is the possible mechanism during room temperature creep deformation of these alloys. The introduction of 3% Bi into the binary alloy enhanced the creep resistance due to both solid solutioning effect and sparse precipitation of Bi in the Sn matrix.

Original languageEnglish
Pages (from-to)312-318
Number of pages7
JournalJournal of Materials Science-Materials in Electronics
Volume20
Issue number4
DOIs
Publication statusPublished - Apr 2009

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Atomic and Molecular Physics, and Optics
  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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