3D modeling of high temperature superconducting staggered array undulator

Zhaoyang Zhong; Min Zhang; Wei Wang; M. Chudy; Yiran Chen; Chai-Hao Hsu; Zhen Huang; T. A. Coombs

doi:10.1109/TASC.2013.2238271

3D modeling of high temperature superconducting staggered array undulator

Zhaoyang Zhong
, Min Zhang
, Wei Wang
, M. Chudy
, Yiran Chen
, Chai-Hao Hsu
, Zhen Huang
, T. A. Coombs

Department of Electronic & Electrical Engineering

University of Cambridge

Research output: Contribution to journal › Article › peer-review

3 Citations (SciVal)

Original language	English
Pages (from-to)	4101004-4101004
Journal	IEEE Transactions on Applied Superconductivity
Volume	23
Issue number	3
DOIs	https://doi.org/10.1109/TASC.2013.2238271
Publication status	Published - 1 Jun 2013

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title = "3D modeling of high temperature superconducting staggered array undulator",

author = "Zhaoyang Zhong and Min Zhang and Wei Wang and M. Chudy and Yiran Chen and Chai-Hao Hsu and Zhen Huang and Coombs, \{T. A.\}",

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AU - Zhong, Zhaoyang

AU - Zhang, Min

AU - Wang, Wei

AU - Chudy, M.

AU - Chen, Yiran

AU - Hsu, Chai-Hao

AU - Huang, Zhen

AU - Coombs, T. A.

PY - 2013/6/1

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UR - http://dx.doi.org/10.1109/TASC.2013.2238271

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DO - 10.1109/TASC.2013.2238271

M3 - Article

SN - 1051-8223

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SP - 4101004

EP - 4101004

JO - IEEE Transactions on Applied Superconductivity

JF - IEEE Transactions on Applied Superconductivity

IS - 3

ER -

3D modeling of high temperature superconducting staggered array undulator

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