3D modeling of high temperature superconducting staggered array undulator

Zhaoyang Zhong, Min Zhang, Wei Wang, M. Chudy, Yiran Chen, Chai-Hao Hsu, Zhen Huang, T. A. Coombs

Research output: Contribution to journalArticle

2 Citations (Scopus)
Original languageEnglish
Pages (from-to)4101004-4101004
JournalIEEE Transactions on Applied Superconductivity
Volume23
Issue number3
DOIs
Publication statusPublished - 1 Jun 2013

Cite this

Zhong, Z., Zhang, M., Wang, W., Chudy, M., Chen, Y., Hsu, C-H., Huang, Z., & Coombs, T. A. (2013). 3D modeling of high temperature superconducting staggered array undulator. IEEE Transactions on Applied Superconductivity, 23(3), 4101004-4101004. https://doi.org/10.1109/TASC.2013.2238271