Oxford Plasma Pro System 100 Cobra ICP

    Facility/equipment: Equipment

    • Location

      University of Bath Claverton Down Bath BA2 7AY

      UK United Kingdom

    Equipments Details


    Plasma dry etching with the following gases:CHF3, SF6, Ar, O2, SiCl4, Cl2, BCl3 , Load-locked sample exchange for fast processing, Wafers up to 150 mm in diameter, Wafer temperatures from 0-400 °C.


    Explore the research areas in which this equipment has been used. These labels are generated based on the related outputs. Together they form a unique fingerprint.