Oxford Plasma LAB 80 Plus for RIE and ICP etching

    Facility/equipment: Equipment

    • Location

      University of Bath Claverton Down Bath BA2 7AY

      UK United Kingdom

    Equipments Details

    Description

    Plasma dry etching with the following gases: CHF3, SF6, Ar, O2, SiCl4, Cl2, H2, CH4

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