Equipments Details
Description
Reactive Ion/Inductively Coupled Plasma Etcher. 4" wafer load-locck system. Etch gases available: O2, Ar, CHF3, SiCl4, Cl2, BCl3, SF6
Details
| Name | Make: Oxford Instruments Plasma Technology; Model: Plasma Pro 100 |
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Equipment taxonomy
- Plasma
- Reactive Ion
User-defined keywords
- RIE/ICP Etching
Fingerprint
Explore the research areas in which this equipment has been used. These labels are generated based on the related outputs. Together they form a unique fingerprint.
Research output
- 2 Article
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Competition between vortex and "s"-like states in laterally confined magnetic trilayers
Ognev, A. V., Stebliy, M. E., Samardak, A. S., Nogaret, A. & Chebotkevich, L. A., 2011, In: Physics Procedia. 22, p. 157-162 6 p.Research output: Contribution to journal › Article › peer-review
Open Access1 Link opens in a new tab Citation (SciVal) -
Effect of size and configuration on the magnetization of nickel dot arrays
Nasirpouri, F., Nogaret, A. & Bending, S. J., Dec 2011, In: IEEE Transactions on Magnetics. 47, 12, p. 4695-4700 6 p.Research output: Contribution to journal › Article › peer-review
Open AccessFile9 Link opens in a new tab Citations (SciVal)323 Downloads (Pure)