Equipments Details
Description
Reactive Ion/Inductively Coupled Plasma Etcher. 4" wafer load-locck system. Etch gases available: O2, Ar, CHF3, SiCl4, Cl2, BCl3, SF6
Details
Name | Make: Oxford Instruments Plasma Technology; Model: Plasma Pro 100 |
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Equipment taxonomy
- Plasma
- Reactive Ion
User-defined keywords
- RIE/ICP Etching
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